Patents by Inventor William Royea

William Royea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL PASSIVATION OF SILICON-CONTAINING SURFACES USING ORGANIC LAYERS
    Publication number: 20100164073
    Abstract: Electrical structures and devices may be formed and include an organic passivating layer that is chemically bonded to a silicon-containing semiconductor material to improve the electrical properties of electrical devices. In different embodiments, the organic passivating layer may remain within finished devices to reduce dangling bonds, improve carrier lifetimes, decrease surface recombination velocities, increase electronic efficiencies, or the like. In other embodiments, the organic passivating layer may be used as a protective sacrificial layer and reduce contact resistance or reduce resistance of doped regions. The organic passivation layer may be formed without the need for high-temperature processing.
    Type: Application
    Filed: July 20, 2009
    Publication date: July 1, 2010
    Applicant: THE CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Nathan S. Lewis, William Royea
  • Electrical passivation of silicon-containing surfaces using organic layers
    Patent number: 7491642
    Abstract: Electrical structures and devices may be formed and include an organic passivating layer that is chemically bonded to a silicon-containing semiconductor material to improve the electrical properties of electrical devices. In different embodiments, the organic passivating layer may remain within finished devices to reduce dangling bonds, improve carrier lifetimes, decrease surface recombination velocities, increase electronic efficiencies, or the like. In other embodiments, the organic passivating layer may be used as a protective sacrificial layer and reduce contact resistance or reduce resistance of doped regions. The organic passivation layer may be formed without the need for high-temperature processing.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: February 17, 2009
    Assignee: The California Institute of Technology
    Inventors: Nathan S. Lewis, William Royea
  • Electrical passivation of silicon-containing surfaces using organic layers
    Publication number: 20060006433
    Abstract: Electrical structures and devices may be formed and include an organic passivating layer that is chemically bonded to a silicon-containing semiconductor material to improve the electrical properties of electrical devices. In different embodiments, the organic passivating layer may remain within finished devices to reduce dangling bonds, improve carrier lifetimes, decrease surface recombination velocities, increase electronic efficiencies, or the like. In other embodiments, the organic passivating layer may be used as a protective sacrificial layer and reduce contact resistance or reduce resistance of doped regions. The organic passivation layer may be formed without the need for high-temperature processing.
    Type: Application
    Filed: September 2, 2005
    Publication date: January 12, 2006
    Applicant: California Institute of Technology
    Inventors: Nathan Lewis, William Royea
  • Electrical passivation of silicon-containing surfaces using organic layers
    Publication number: 20020139975
    Abstract: Electrical structures and devices may be formed and include an organic passivating layer that is chemically bonded to a silicon-containing semiconductor material to improve the electrical properties of electrical devices. In different embodiments, the organic passivating layer may remain within finished devices to reduce dangling bonds, improve carrier lifetimes, decrease surface recombination velocities, increase electronic efficiencies, or the like. In other embodiments, the organic passivating layer may be used as a protective sacrificial layer and reduce contact resistance or reduce resistance of doped regions. The organic passivation layer may be formed without the need for high-temperature processing.
    Type: Application
    Filed: July 12, 2001
    Publication date: October 3, 2002
    Inventors: Nathan S. Lewis, William Royea