Patents by Inventor William S. Graham

William S. Graham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Efficient nanoscale solar cell and fabrication method
    Patent number: 8878055
    Abstract: A photovoltaic device and method include a substrate layer having a plurality of structures including peaks and troughs formed therein. A continuous photovoltaic stack is conformally formed over the substrate layer and extends over the peaks and troughs. The photovoltaic stack has a thickness of less than one micron and is configured to transduce incident radiation into current flow.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: November 4, 2014
    Assignee: International Business Machines Corporation
    Inventors: Keith E. Fogel, William S. Graham, Jeehwan Kim, Harold J. Hovel, Devendra K. Sadana, Katherine L. Saenger
  • Microcavity structure and process
    Patent number: 8703274
    Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: April 22, 2014
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
  • MICROCAVITY STRUCTURE AND PROCESS
    Publication number: 20100086739
    Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Applicant: International Business Machines Corporation
    Inventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih