Abstract: An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.

Abstract: An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.

Abstract: An advanced thick film (ATF) pressure transducer can be produced from an advanced thick film stack on a metallic substrate. The metallic substrate has a flexible metallic diaphragm that flexes when there is a pressure differential across its top and bottom surfaces. The conductive and dielectric layers of the ATF stack are patterned into wire networks and bond pads. A strain sensor can be attached to bond pads or can be formed as part of an ATF layer. Flexure of the diaphragm stresses the strain sensor to produce an output proportional to the pressure differential. The ATF pressure transducer can be packaged into a housing that provides easy deployment and electrical interconnectivity.

Abstract: An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to a tubular region protruding from the chamber via compressed air. An evacuating device connected to the tubular region by the chuck then applies a vacuum which evacuates the chamber. When the chamber has been sufficiently evacuated a message is sent to a programmable logic controller which then outputs a signal to an ultrasonic welding apparatus. The ultrasonic welder crimps and seals the tubular region thereby quickly and efficiently creating a permanent vacuum in the chamber.

Abstract: A pressure sensor port apparatus and method comprising a pressure port that includes a hexagonal area preferably comprising a plastic material (e.g., thermoplastic). Additionally, one or more electronic interconnections can be associated with the pressure sensor port, such that the electronic interconnections are isolated from sensed media while providing a pressure sensor port apparatus based on a cost effective injection molding process rather than a machining processes required for a metal.

Abstract: A modular sensing apparatus includes a sensing diaphragm that accommodates a particular pressure range. A pressure port can be connected to the sensing diaphragm to provide pressure data thereof. Additionally, the modular sensing apparatus includes a connector and a temperature sensor pre-selected by a user, such that the connector is attached to a pressure port. An integrated circuit can be configured to provide a desired output for respective pressure and temperature from the sensing diaphragm and the temperatures sensor and to provide error corrections thereof. The sensing diaphragm, the temperature sensor, the integrated circuit and the connector are electrically connected utilizing flexible circuitry to form the modular sensing apparatus assembled to at least one requirement of the user in order to provide simultaneous and application independent pressure and temperature sensing data.