Abstract: A hand operable tool is provided for removing a memory module printed circuit board from an underlying processor board without an appreciable risk of bending the pins of the pin-and-socket connectors used to removably secure the circuit board to the processor board. The tool comprises a generally inverted U-shaped outer frame structure having a pair of parallel, inturned bottom pressure plates secured to its lower ends. A shorter, generally inverted U-shaped inner frame structure is slidably retained within the outer frame structure and has a pair of parallel, inturned upper pressure plates secured to its lower ends. The inner frame structure is spring-biased to a lower limit position in which the upper pressure plates engage the bottom pressure plates, and a pair of elongated upper and lower handle members are connected to the frame structures.