Abstract: An apparatus to facilitate level-of-detail (LoD) determination using major squared and efficient clamping in a graphics environment is disclosed. The apparatus includes a processing core comprising a rasterizer hardware unit to: identify components of partial derivative vectors corresponding to two adjacent lines of a quadrilateral in texture space of an image, the quadrilateral corresponding to a pixel sampling area in screen space; combine the partial derivative vectors into a transformation matrix representing a transformation of coordinates from the screen space to the texture space; determine a value of a square of a major axis length (major squared) of the ellipse based on a sum of squares (SOS) of the components of the transformation matrix and a determinant of the transformation matrix; and compute a LoD value and an anisotropic ratio (iratio) value using the determinant of the transformation matrix and the value of the major squared.

Abstract: An apparatus to facilitate level-of-detail (LoD) eigenvector determination in a graphics environment is disclosed. The apparatus includes a processing core comprising a rasterizer hardware unit to: identify components of partial derivative vectors corresponding to two adjacent lines of a quadrilateral in texture space of an image, the quadrilateral corresponding to a pixel sampling area in screen space; combine the partial derivative vectors into a transformation matrix representing a transformation of coordinates from the screen space to the texture space; determine a value of a square of a major axis length (major squared) of the ellipse based on a sum of squares (SOS) of the components of the transformation matrix and a determinant of the transformation matrix; and compute eigenvector values for the ellipse using the components of the partial derivative vectors, the determinant of the transformation matrix, and the value of the major squared.

Abstract: Methods for reducing quick charge loss effects, methods for programming, memory devices, memory devices, and memory systems are disclosed. In one such method, a programming pulse is applied to the word line to increase the threshold voltage of the memory cells being programmed. A negative voltage pulse is applied to the word line after the programming pulse to force any electrons trapped in the tunnel oxide of memory cells being programmed back into the tunnel region. After the negative pulse, a program verify operation is performed.

Abstract: Methods and apparatus are disclosed, such as those involving a flash memory device that includes a memory block. The memory block includes a plurality of data lines extending substantially parallel to one another, and a plurality of memory cells. One such method includes erasing the memory cells; and performing erase verification on the memory cells. The erase verification includes determining one memory cell by one memory cell whether the individual memory cells coupled to one of the data lines have been erased. The method can also include performing a re-erase operation that selectively re-erases unerased memory cells based at least partly on the result of the erase verification.

Abstract: Methods for reducing quick charge loss effects, methods for programming, memory devices, memory devices, and memory systems are disclosed. In one such method, a programming pulse is applied to the word line to increase the threshold voltage of the memory cells being programmed. A negative voltage pulse is applied to the word line after the programming pulse to force any electrons trapped in the tunnel oxide of memory cells being programmed back into the tunnel region. After the negative pulse, a program verify operation is performed.

Abstract: Methods for reducing quick charge loss effects, methods for programming, memory devices, memory devices, and memory systems are disclosed. In one such method, a programming pulse is applied to the word line to increase the threshold voltage of the memory cells being programmed. A negative voltage pulse is applied to the word line after the programming pulse to force any electrons trapped in the tunnel oxide of memory cells being programmed back into the tunnel region. After the negative pulse, a program verify operation is performed.

Abstract: Methods and apparatus are disclosed, such as those involving a flash memory device that includes a memory block. The memory block includes a plurality of data lines extending substantially parallel to one another, and a plurality of memory cells. One such method includes erasing the memory cells; and performing erase verification on the memory cells. The erase verification includes determining one memory cell by one memory cell whether the individual memory cells coupled to one of the data lines have been erased. The method can also include performing a re-erase operation that selectively re-erases unerased memory cells based at least partly on the result of the erase verification.

Abstract: Methods and apparatus are disclosed, such as those involving a flash memory device that includes a memory block. The memory block includes a plurality of data lines extending substantially parallel to one another, and a plurality of memory cells. One such method includes erasing the memory cells; and performing erase verification on the memory cells. The erase verification includes determining one memory cell by one memory cell whether the individual memory cells coupled to one of the data lines have been erased. The method can also include performing a re-erase operation that selectively re-erases unerased memory cells based at least partly on the result of the erase verification.

Abstract: A method and apparatus for dynamic programming and dynamic reading of a select non-volatile memory cell in a virtual grounds array is disclosed. In the dynamic read operation the global bit lines and the associated local bit lines are connected to a precharged voltage. One of the first or second global bit lines is connected to a low voltage such as ground, wherein the one global bit line connected to ground also connects to the local bit line for sensing the select non-volatile memory cell. The state of the select non-volatile memory cell is detected by detecting the sense amplifier connected to the global bit line, other than the one global bit line. In a dynamic programming operation, the first and second global bit lines and their associated local bit lines are precharged to a first voltage. One of the first or second global bit line and its associated local bit lines is connected to a second voltage.

Abstract: Methods for reducing quick charge loss effects, methods for programming, memory devices, memory devices, and memory systems are disclosed. In one such method, a programming pulse is applied to the word line to increase the threshold voltage of the memory cells being programmed. A negative voltage pulse is applied to the word line after the programming pulse to force any electrons trapped in the tunnel oxide of memory cells being programmed back into the tunnel region. After the negative pulse, a program verify operation is performed.

Abstract: Methods and apparatus are disclosed, such as those involving a flash memory device that includes a memory block. The memory block includes a plurality of data lines extending substantially parallel to one another, and a plurality of memory cells. One such method includes erasing the memory cells; and performing erase verification on the memory cells. The erase verification includes determining one memory cell by one memory cell whether the individual memory cells coupled to one of the data lines have been erased. The method can also include performing a re-erase operation that selectively re-erases unerased memory cells based at least partly on the result of the erase verification.

Abstract: A method and apparatus for dynamic programming and dynamic reading of a select non-volatile memory cell in a virtual grounds array is disclosed. The array of non-volatile memory cells are arranged in a plurality of rows and columns, wherein each cell in the same column share a first local bit line to one side and share a second local bit line to another side. Alternating local bit lines are connected to a first global bit line and other alternating local bit lines are connected to a second global bit line with the global bit lines connected to a sense amplifier. In the dynamic read operation the global bit lines and the associated local bit lines are connected to a precharged voltage. One of the first or second global bit lines is connected to a low voltage such as ground, wherein the one global bit line connected to ground also connects to the local bit line for sensing the select non-volatile memory cell.

Abstract: A test device and method may be used to detect voltage, current or signals of a digital multilevel memory cell system or to test operation or performance by applying inputted voltages, currents or signals to the memory cell system.

Abstract: A digital multilevel non-volatile memory includes a massive sensing system that includes a plurality of sense amplifiers disposed adjacent subarrays of memory cells. The sense amplifier includes a high speed load, a wide output range intermediate stage and a low impedance output driver. The high speed load provides high speed sensing. The wide output range provides a sensing margin at high speed on the comparison node. The low impedance output driver drives a heavy noisy load of a differential comparator. A precharge circuit coupled to the input and output of the sense amplifier increases the speed of sensing. A differential comparator has an architecture that includes analog bootstrap. A reference sense amplifier has the same architecture as the differential amplifier to reduce errors in offset. The reference differential amplifier also includes a signal multiplexing for detecting the contents of redundant cells and reference cells.

Abstract: An integrated MIS capacitor has two substantially identical MIS capacitors. A first capacitor comprises a first region of a first conductivity type adjacent to a channel region of the first conductivity type in a semiconductor substrate. The semiconductor substrate has a second conductivity type. A gate electrode is insulated and spaced apart from the channel region of the first capacitor. The second capacitor is substantially identical to the first capacitor and is formed in the same semiconductor substrate. The gate electrode of the first capacitor is electrically connected to the first region of the second capacitor and the gate electrode of the second capacitor is electrically connected to the first region of the first capacitor. In this manner, the capacitors are connected in an anti-parallel configuration.

Abstract: A high voltage generator provides high voltage signals with different regulated voltage levels. A charge pump generates the high voltage, and includes a quadrature phase forward and backward Vt-canceling high-voltage self-biasing charge pump with a powerup-assist diode. A high voltage series regulator generates the high voltage supply levels, and includes slew rate enhancement and trimmable diode regulation. A nested loop regulator eliminates shunt regulation.

Abstract: A high voltage generator provides high voltage signals with different regulated voltage levels. A charge pump generates the high voltage, and includes a quadrature phase forward and backward Vt-canceling high-voltage self-biasing charge pump with a powerup-assist diode. A high voltage series regulator generates the high voltage supply levels, and includes slew rate enhancement and trimmable diode regulation. A nested loop regulator eliminates shunt regulation.

Abstract: A digital multilevel bit memory array system comprises regular memory arrays and redundant memory arrays. A regular y-driver corresponds to each memory array to read or write contents to a multilevel bit memory cell and compare the read cell content to reference voltage levels to determine the data stored in the corresponding memory cell. Likewise, similar functions are performed by the redundant y-driver circuit for the redundant memory array. During the verification of the contents of the memory cell, if the read voltage is outside a certain margin requirement for a level of the reference voltage, a signal is generated in real time so that data from the bad y-driver is not output and data from the redundant y-driver corresponding to the redundant memory array is read out. The memory array system may also include a fractional multilevel redundancy.

Abstract: Bulk operation logic circuitry for use in carrying out bulk program, erase, verify and margining operations on nonvolatile memory cells of a PLD, FPGA, flash-based microcontroller, EEPROM, flash memory device or other integrated circuit containing such cells includes a flag register for designating one or more selected blocks of cells to which the bulk operation will be limited. The bulk operation circuitry includes a controller, with a state machine and associated control logic, that distributes system clock signals and provides control signals to an instruction register, the flag register, an address register and one or more data registers to control loading of instructions and data into those registers through a serial input. The state machine is responsive to a mode signal for switching it from a normal user state into a bulk operation state.