Abstract: Light-emitting diode (LED) devices and more particularly LED devices with stress mitigation structures in lead frames for LED packages and related devices are disclosed. Stress mitigation structures include one or more leads that form floating bond pads for receiving at least one contact of a flip-chip LED. The floating bond pads are configured to be decoupled from bonding regions for corresponding LED packages. Leads that form floating bond pads are electrically coupled to other leads by way of electrical connectors with increased elasticity relative to the lead frame. During operation, transfer of stress associated with coefficient of thermal expansion differences between LED packages and associated mounting boards is reduced.