Abstract: A fence component buried in the earth having a generally planar base portion, having a generally flat bottom surface and a generally ridged upper surface. The fence component includes a generally vertical support secured to the base, the support located substantially off-center of the base portion.

Abstract: A fence component buried in the earth having a generally planar base portion, having a generally flat bottom surface and a generally ridged upper surface. The fence component includes a generally vertical support secured to the base, the support located substantially off-center of the base portion.

Abstract: A top loaded burn-in socket for forming a plurality of electrical connections between a ball gird array (BGA) package having a plurality of conductive ball leads and an electrical component is provided. The socket assembly includes a plurality of resilient electrical contacts; a cam being configured to position the contacts from a first position to a second position; a device guide plate including a plurality of openings for receiving the ball leads; and an actuating mechanism configured to interact with the cam to position the contacts, wherein an upper portion of the contacts engages the ball leads between the upper portion and an inclined surface of the device guide plate openings. Each ball is thus held in a manner that does not require the use of a hold down mechanism for effecting electrical continuity between the BGA package and the contacts of the subject burn-in socket.

Abstract: A top loaded burn-in socket for forming a plurality of electrical connections between a ball gird array (BGA) package having a plurality of conductive ball leads and an electrical component is provided. The socket assembly includes a plurality of resilient electrical contacts; a cam being configured to position the contacts from a first position to a second position; a device guide plate including a plurality of openings for receiving the ball leads; and an actuating mechanism configured to interact with the cam to position the contacts, wherein an upper portion of the contacts engages the ball leads between the upper portion and an inclined surface of the device guide plate openings. Each ball is thus held in a manner that does not require the use of a hold down mechanism for effecting electrical continuity between the BGA package and the contacts of the subject burn-in socket.

Abstract: A method of creating domed shaped contacts on a printed circuit board includes etching a central opening in each copper pad, and then screening a mound of silver epoxy into the opening. The silver epoxy above the pad slumps to form a domed bump. The silver epoxy is then cured and is coated, in turn, by a layer of electroless nickel and gold. The resulting gold plated contacts are of monolithic structure and function to facilitate connection to a mezzanine board.

Abstract: A shielded semiconductor chip carrier having a high-density external interface includes conventional printed circuit boards having plated through holes for achieving shielding of the contacts of the matrix. Two fork type connectors have molded about the distal ends thereof an annular ring of dielectric plastic material, and fork type connectors are press fit into each plated through hole, thereby locking the electrical contact within the shield formed by the plated through hole. The resulting connector provides a high-density contact matrix with each connector being electrically shielded along substantially its entire length.