Abstract: A conventional floor cleaning mop has a cleaning pad support platen defining a support cleaning surface region that is arranged to releasably receive and secure a conventional cleaning pad via Velcro hook fasteners on the platen. The cleaning pad has a relatively non-abrasive cleaning surface. A scrub device with a relatively more abrasive surface is releasably or permanently attached to the pad cleaning surface by an attachment device. One or more such scrub devices may be attached to the same pad cleaning surface to cover part or all of the pad cleaning surface. The abrasive scrub devices may have different dimensions to cover different areas of the cleaning pad non-abrasive surface to provide enhanced scrubbing action as desired. The abrasive scrub devices may be provided with different abrasion surfaces having different abrasive values and may be removed to expose the full non-abrasive cleaning surface for non-abrasive cleaning. The mop may have an optional cleaning fluid dispensing spray device.

Abstract: A plurality of component lead processing assemblies are located in a plane each releasably secured to a different given location on a support structure. Each processing assembly has an anvil and a lead processing part which is rotatable relative to the anvil for performing the lead processing on leads of components secured to a printed circuit board. A link structure is coupled to each lead processing part movable in a direction parallel to the plane of the processing assemblies for concurrently rotating the processing parts in response to the actuation of drive means.