Patents by Inventor William Steven Collins

William Steven Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymeric compositions comprising per(phenylethynyl) arene derivatives
    Patent number: 8502401
    Abstract: A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n- where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1 m; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160° C. to 180° C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: August 6, 2013
    Assignee: Delsper LP
    Inventors: William Franklin Burgoyne, Jr., Mark David Conner, Andrew Francis Nordquist, William Steven Collins
  • Polymeric compositions comprising per(phenylethynyl) arene derivatives
    Patent number: 8373287
    Abstract: A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n- where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1 m; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160° C. to 180° C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: February 12, 2013
    Assignee: Greene, Tweed IP, Inc.
    Inventors: William Franklin Burgoyne, Jr., Mark David Conner, Andrew Francis Nordquist, William Steven Collins
  • POLYMERIC COMPOSITIONS COMPRISING PER(PHENYLETHYNYL) ARENE DERIVATIVES
    Publication number: 20110260343
    Abstract: A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n- where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1 m; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160° C. to 180° C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.
    Type: Application
    Filed: August 10, 2009
    Publication date: October 27, 2011
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: William Franklin Burgoyne, JR., Mark David Conner, Andrew Francis Nordquist, William Steven Collins