Abstract: An air cavity package with one or more dovetail recesses configured with a first recess and a coincident second recess. The first recess has a first depth and the second recess has a second depth. The first recess has a lower width and an upper width smaller than the first lower width creating a dovetail shape. Individual dovetail recesses are created by creating a first recess in the flange at a first width and depth. A second recess with a second width and second depth and coincident with the first recess is pressed into the flange. The second width is greater than the first width and the second depth is smaller than the first depth. Pressing the second recess causes the first width at an upper portion to decrease, causing the first recess to develop a dovetail shape.

Abstract: A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination . The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12 do not detract from the purpose of the die attach solder (36).

Abstract: A winch drive assembly comprises a motor-driven winch drive (1) drivably engageable with a winch (11) and a laterally-outwardly extending member (4) attached to the winch drive (1), the laterally-outwardly extending member (4) being engageable with a stop for hindering or preventing rotation of the winch drive (1) during driving of the winch (11).

Abstract: A winch drive comprising a portable power tool having a bit (4) shaped to fit the drive socket (11) at the top of a winch (12). The power tool includes a self-tailing device (14) and is preferably battery driven.