Patents by Inventor William Swallow

William Swallow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090255651
    Abstract: A heat dissipater and a method of dissipating heat. The present disclosure relates to a heat dissipating device which dissipates heat out of an enclosure. The device comprises a housing positioned within the enclosure, wherein the housing has an intake and an exhaust. The device further comprises an air medium disposed within the enclosure. At least one air handler in communication with the housing transfers the air medium through the housing and out of the enclosure. The present disclosure relates to a method of dissipating heat generated by a component comprising disposing a housing within an enclosure, the enclosure having the component which generates heat. Next, a convection is maintained through the housing and across the component. Cooling is then performed by channeling the air out of the enclosure.
    Type: Application
    Filed: April 14, 2009
    Publication date: October 15, 2009
    Inventor: William Swallow
  • Publication number: 20060201667
    Abstract: A heat dissipater and a method of dissipating heat. The present disclosure relates to a heat dissipating device which dissipates heat out of an enclosure. The device comprises a housing positioned within the enclosure, wherein the housing has an intake and an exhaust. The device further comprises an air medium disposed within the enclosure. At least one air handler in communication with the housing transfers the air medium through the housing and out of the enclosure. The present disclosure relates to a method of dissipating heat generated by a component comprising disposing a housing within an enclosure, the enclosure having the component which generates heat. Next, a convection is maintained through the housing and across the component. Cooling is then performed by channeling the air out of the enclosure.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 14, 2006
    Inventor: William Swallow