Abstract: A coil former, also referred to herein as a bobbin, is provided for use in conduction-cooled magnetic components that contain an air gap. The diameter of the disclosed bobbin is increased and ribs/splines or tabs are created to keep the winding centered about the core center post while allowing thermally conductive silicone-based or equivalent encapsulant to fill the voids between the coil former and the core, the coil former and the windings and/or both depending on the placement of the locating tabs. The disclosed bobbin may be fabricated from traditional injection molding resins or from high-thermal conductivity resins. As a result of the disclosed bobbin designs, the achievable power density is increased while maintaining acceptable temperatures.

Abstract: The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.

Abstract: A coil former, also referred to herein as a bobbin, is provided for use in conduction-cooled magnetic components that contain an air gap. The diameter of the disclosed bobbin is increased and ribs/splines or tabs are created to keep the winding centered about the core center post while allowing thermally conductive silicone-based or equivalent encapsulant to fill the voids between the coil former and the core, the coil former and the windings and/or both depending on the placement of the locating tabs. The disclosed bobbin may be fabricated from traditional injection molding resins or from high-thermal conductivity resins. As a result of the disclosed bobbin designs, the achievable power density is increased while maintaining acceptable temperatures.

Abstract: A device includes: an electronic component that generates heat; a heatsink configured to absorb at least part of the heat through thermal transfer; and a thermally conductive dielectric pad that attaches the electronic component and the heatsink to each other and facilitates the thermal transfer. The thermally conductive dielectric pad includes: a ceramic tile; a first layer of adhesive that attaches a first side of the ceramic tile to the electronic component; and a second layer of adhesive that attaches a second side of the ceramic tile to the heatsink.

Abstract: The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.

Abstract: A server housing assembly includes a main chassis and a bezel assembly. The main chassis preferably has a 1U form factor. The bezel assembly includes a bezel chassis slidably received by the main chassis such that the bezel assembly is slidable between an inward position and an outward position with respect to the main chassis. The bezel assembly includes a bezel pivotally coupled to the bezel chassis to be pivotable between an upper position and a lower position with respect to the main chassis. The main chassis includes main electronic components, and the bezel assembly includes bezel electronic components electrically coupled or coupleable to the main electronic components. The bezel assembly is operatively associated with the main chassis such that the bezel electronic components remain electrically coupled to the main electronic components through all positions of the bezel assembly or the bezel.

Abstract: A server housing assembly includes a main chassis and a bezel assembly. The main chassis preferably has a 1U form factor. The bezel assembly includes a bezel chassis slidably received by the main chassis such that the bezel assembly is slidable between an inward position and an outward position with respect to the main chassis. The bezel assembly includes a bezel pivotally coupled to the bezel chassis to be pivotable between an upper position and a lower position with respect to the main chassis. The main chassis includes main electronic components, and the bezel assembly includes bezel electronic components electrically coupled or coupleable to the main electronic components. The bezel assembly is operatively associated with the main chassis such that the bezel electronic components remain electrically coupled to the main electronic components through all positions of the bezel assembly or the bezel.