Abstract: A method of monitoring a microelectronic manufacturing process includes the implementation of a monitoring sensor that is configured to operate in an inter-process mode. During an inter-process mode, a first valve is opened in order to initiate transfer of a processing substrate between at least one processing chamber and a transfer chamber. The monitoring sensor is programmed to monitor the interior of the at least one processing chamber only after the first valve is opened.

Abstract: A process for the production of a hydroxyapatite coated article includes contacting a coating comprising hydroxyapatite with a recrystallization medium, pressurizing the recrystallization medium, heating the coated article under conditions of reduced oxygen activity at a temperature in the range of 100 to 350.degree. C. A process for the production of highly crystalline hydroxyapatite coated articles includes contacting a coating comprising hydroxyapatite with recrystallization medium containing hydroxyapatite particles, pressurizing the recrystallization medium, and heating the immersed coated article under conditions effective to crystallize hydroxyapatite.

Abstract: A process for the production of a hydroxyapatite coated article includes contacting a coating comprising hydroxyapatite with a recrystallization medium, pressurizing the recrystallization medium, heating the coated article under conditions of reduced oxygen activity at a temperature in the range of 100.degree. to 350.degree. C. A process for the production of highly crystalline hydroxyapatite coated articles includes contacting a coating comprising hydroxyapatite with recrystallization medium containing hydroxyapatite particles, pressurizing the recrystallization medium, and heating the immersed coated article under conditions effective to crystallize hydroxyapatite.

Abstract: The invention features a method of depositing a coating on a medical device. The method includes: a) placing the medical device in an evacuated chamber, b) introducing a noble gas into the chamber, c) providing at least one target in the chamber, spaced from the device, and d) sputter depositing a coating onto the device by applying power to the target so that the noble gas forms a plasma in the vicinity of the target and material is sputtered from the target by ion bombardment and deposited on the device.In another aspect, the invention features a medical device having a coating deposited by a plasma sputtering process. Preferably, the coating is a calcium containing compound.

Abstract: A new technique has been developed to measure etching or deposition rate uniformity in situ using a CCD camera which views the wafer during plasma processing. The technique records the temporal modulation of plasma emission or laser illumination reflected from the wafer; this modulation is caused by interferometry as thin films are etched or deposited. The measured etching rates compare very well with those determined by Helium-Neon laser interference. This technique is capable of measuring etching rates across 100-mm or larger wafers. It can resolve etch rate variations across a wafer or within a die. The invention can also be used to make endpoint determinations in etching operations as well as measuring the absolute thickness of thin films.