Patents by Inventor William T. Davies

William T. Davies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure
    Patent number: 6037192
    Abstract: A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate.
    Type: Grant
    Filed: January 22, 1998
    Date of Patent: March 14, 2000
    Assignee: Nortel Networks Corporation
    Inventors: Sorin Witzman, Elizabeth M. Tencer, Michal S. Tencer, William T. Davies, Richard S. Kubin