Patents by Inventor William T. Flaherty, Jr.

William T. Flaherty, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making for RF line replacable modules
    Patent number: 4974317
    Abstract: A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.
    Type: Grant
    Filed: April 20, 1989
    Date of Patent: December 4, 1990
    Assignee: Westinghouse Electric Corp.
    Inventors: Noe E. Rodriguez, II, William T. Flaherty, Jr., Sharon A. Duggan, Timothy M. Fertig
  • Building block composite design and method of making for RF line replaceable modules
    Patent number: 4837664
    Abstract: A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.
    Type: Grant
    Filed: September 12, 1988
    Date of Patent: June 6, 1989
    Assignee: Westinghouse Electric Corp.
    Inventors: Noe E. Rodriguez, II, William T. Flaherty, Jr., Sharon A. Duggan, Timothy M. Fertig