Abstract: A method of attaching two wafers in a seismometer comprising the steps of forming a patterned wetting metal layer on a first wafer and forming a plurality of cavities mirroring the pattern of the wetting metal layer on the first wafer. The steps further include pouring a plurality of solder balls on the surface of an alignment wafer, pouring off excess solder balls, aligning the first wafer with the alignment wafer, and connecting the first wafer with the alignment wafer. The solder balls are immobilized on the wetting metal layer by performing a partial reflow onto the wetting metal layer and removing the alignment wafer. The first and second wafers are aligned so that each solder ball is immobilized between the first and second wafer. The wafers are then bonded together.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.

Abstract: Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films are placed within a microwave cavity containing other less microwave absorbing materials, and excited to cause selective heating in the skin depth of the films. This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.

Abstract: Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films are placed within a microwave cavity containing other less microwave absorbing materials, and excited to cause selective heating in the skin depth of the films. This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.

Abstract: A method to verify that a test and measurement system continues to operate within a predetermined acceptable range with respect to a given calibrated state previously defined for that system without the need for conventional external reference components. In accordance with one embodiment, performance verification of a network analyzer used to perform electrical measurements is achieved by storing RF "thru" measurement data (an RF thru measurement trace of the system) at the time of calibration at the factory or later repair and/or recalibration at a field service site. In accordance with another embodiment, performance verification of a lightwave component analyzer, used to perform electrical, electro-optical, opto-electrical, and optical measurements, is achieved by storing RF and optical thru measurement data (both an RF thru measurement trace of the system and an optical thru measurement trace of the system) at the time of calibration at the factory or later repair and/or recalibration.

Abstract: A vector network analyzer for performing swept frequency measurements on non-linear RF devices, using either an internal or external signal source. This simplifies and speeds linear and non-linear amplifier and mixer measurements, such as impedance, amplifier gain, and mixer conversion loss, on the one hand, and measurement of harmonics, on the other hand.

Abstract: A signal measurement system with softkey menus for enabling a user to select a desired test setup, including selection of test measurement for a device. The signal measurement system prompts the user with a set of displayed softkey selections via a user interface to step the user through the setup process. Preferably, a signal processing unit (or analyzer) included in the signal measurement system incorporates the user interface in firmware to aid the user in entering a test sequence for the device to be tested. The analyzer preferably displays the softkey menus on a cathode ray tube included in the analyzer to guide the user. The user is guided through the test sequencing procedure by depressing softkeys. A set of softkey labels (softkey menu) is presented on the display of the analyzer by the firmware for each step in the test sequencing series. As each step of a desired test sequence is entered by the user, the step is displayed on the CRT.