Abstract: A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.