Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: A shoe with an ankle protector comprising a support panel along the lateral aspect or outwardly facing side of a shoe securely fastened to the shoe along the bottom edge of the support panel which extends from about mid-heel forwardly to the point on the shoe which is adjacent the distal joint of the wearer's fifth metatarsal, and an inelastic or non-stretchable strap extending from the rear edge of the support panel around the back of the shoe at an upwardly inclined angle, then forwardly across the upper part of the shoe along the medial aspect or inwardly facing side adjacent the medial malleolus of the tibia portion of the wearer's ankle, then around the front portion of the shoe and downwardly for connection of the strap to a forward portion of said support panel.