Patents by Inventor William Thomas Chi

William Thomas Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device with top-side base plate
    Patent number: 10658276
    Abstract: A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: May 19, 2020
    Assignee: Tesla, Inc.
    Inventors: William Thomas Chi, Mehmet Ozbek, Satish Thuta
  • DEVICE WITH TOP-SIDE BASE PLATE
    Publication number: 20170236773
    Abstract: A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.
    Type: Application
    Filed: February 16, 2017
    Publication date: August 17, 2017
    Applicant: Tesla, Inc.
    Inventors: William Thomas Chi, Mehmet Ozbek, Satish Thuta
  • Power electronics interconnection for electric motor drives
    Patent number: 8686288
    Abstract: The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: April 1, 2014
    Assignee: Tesla Motors, Inc.
    Inventors: Nicholas Robert Kalayjian, Joshua Willard Ferguson, Benjamin David Dettmann, Ryan Carter Kroeze, Michael Raj Kubba, William Thomas Chi
  • POWER ELECTRONICS INTERCONNECTION FOR ELECTRIC MOTOR DRIVES
    Publication number: 20120305283
    Abstract: The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.
    Type: Application
    Filed: May 31, 2011
    Publication date: December 6, 2012
    Applicant: Tesla Motors, Inc.
    Inventors: Nicholas Robert Kalayjian, Joshua Willard Ferguson, Benjamin David Dettmann, Ryan Carter Kroeze, Michael Raj Kubba, William Thomas Chi