Abstract: The inventive subject matter herein is directed toward improved scheduling and planning system that detects a problematic event in a workflow. When the event is detected, the system automatically notifies a set of contacts from a hierarchical contact list. The system then automatically notifies other sets of contacts depending upon the response from the first set of contacts. A cascade of different types of notifications could be triggered from a single detected event as each contact responds and provides information that could be used to trigger additional notifications.

Abstract: The inventive subject matter herein is directed toward improved scheduling and planning system that detects a problematic event in a workflow. When the event is detected, the system automatically notifies a set of contacts from a hierarchical contact list. The system then automatically notifies other sets of contacts depending upon the response from the first set of contacts. A cascade of different types of notifications could be triggered from a single detected event as each contact responds and provides information that could be used to trigger additional notifications.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer and a corresponding interna