Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

Abstract: This system and method minimize an effect of haze to signal-to-noise ratio and compensate for haze on the haze map. A first mask with a first aperture is disposed along the path of the light beam between a light source and a collector. A first actuator moves the first mask along a tangential direction. A second mask with a second aperture is disposed along the path of the light beam between the first mask and the collector. A second actuator moves the second mask along a radial direction perpendicular to the tangential direction. The first mask and the second mask are independently movable along the tangential direction and the radial direction using the first actuator and the second actuator.

Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

Abstract: A wafer crack detection system includes a rotational wafer stage assembly configured to secure a wafer and selectively rotate the wafer, a light source positioned on a first side of the wafer and configured to direct a light beam through the wafer, a sensor positioned on a second side of the wafer and configured to monitor one or more characteristics of light transmitted through the wafer as the wafer is rotated, and a controller communicatively coupled to the sensor and a portion of the rotational wafer stage assembly, the controller configured to: determine the presence of one or more cracks in the wafer based on the monitored one or more characteristics of light transmitted through the wafer, and, responsive to the determination of the presence of one or more cracks in the wafer, direct the rotational stage assembly to adjust the rotational condition of the wafer.

Abstract: A wafer crack detection system includes a rotational wafer stage assembly configured to secure a wafer and selectively rotate the wafer, a light source positioned on a first side of the wafer and configured to direct a light beam through the wafer, a sensor positioned on a second side of the wafer and configured to monitor one or more characteristics of light transmitted through the wafer as the wafer is rotated, and a controller communicatively coupled to the sensor and a portion of the rotational wafer stage assembly, the controller configured to: determine the presence of one or more cracks in the wafer based on the monitored one or more characteristics of light transmitted through the wafer, and, responsive to the determination of the presence of one or more cracks in the wafer, direct the rotational stage assembly to adjust the rotational condition of the wafer.