Patents by Inventor William Varnell

William Varnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flame retardant compositions with a phosphorated compound
    Publication number: 20060102882
    Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
    Type: Application
    Filed: November 8, 2005
    Publication date: May 18, 2006
    Applicant: Polyclad Laminates, Inc.
    Inventors: David Bedner, William Varnell
  • Low expansion dielectric compositions
    Publication number: 20060074151
    Abstract: Dielectric compositions comprising a first component and a second component present at about 5 parts to about 60 parts filler per 100 parts of the first component are disclosed. In certain examples, the first component includes a polyphenylene ether, a polyepoxide, and optionally a compatibilizing agent and a catalyst. Certain examples of the dielectric compositions disclosed herein have low coefficients of thermal expansion. Prepregs, laminates, molded articles and printed circuit boards using the dielectric compositions are also disclosed.
    Type: Application
    Filed: September 28, 2004
    Publication date: April 6, 2006
    Applicant: Polyclad Laminates, Inc.
    Inventors: Guoren He, William Varnell, Thomas Williams
  • Flame retardant compositions
    Publication number: 20060069185
    Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
    Type: Application
    Filed: September 28, 2004
    Publication date: March 30, 2006
    Applicant: Polyclad Laminates, Inc.
    Inventors: Guoren He, William Varnell, Thomas Williams
  • Cooling devices and methods of using them
    Publication number: 20050151554
    Abstract: A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
    Type: Application
    Filed: July 15, 2004
    Publication date: July 14, 2005
    Applicant: Cookson Electronics, Inc.
    Inventors: Alan Rae, Bawa Singh, William Varnell, Angelo Gulino, Mitch Holtzer, Joe Abys, Brian Lewis