Patents by Inventor William Vis

William Vis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12442993
    Abstract: A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: October 14, 2025
    Assignee: Rockley Photonics Limited
    Inventors: Chia-Te Chou, Albert Benzoni, Michael Lee, Cristian Stagarescu, William Vis, Melissa Ziebell
  • Patent number: 12105333
    Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: October 1, 2024
    Assignee: Rockley Photonics Limited
    Inventors: Chia-Te Chou, William Vis, Alexander Gondarenko, Shuhe Li, David McCann, Haydn Frederick Jones, Alexander Fast
  • Publication number: 20240094484
    Abstract: A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.
    Type: Application
    Filed: December 17, 2021
    Publication date: March 21, 2024
    Inventors: Chia-Te CHOU, Albert BENZONI, Michael LEE, Cristian STAGARESCU, William VIS, Melissa ZIEBELL
  • Publication number: 20240077688
    Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.
    Type: Application
    Filed: January 6, 2022
    Publication date: March 7, 2024
    Inventors: Chia-Te Chou, William Vis, Alexander Gondarenko, Shuhe Li, David McCann, Haydn Frederick Jones, Alexander Fast
  • Patent number: 11520112
    Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: December 6, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Yi Zhang, Chia-Te Chou, William Vis, Amit Singh Nagra, Hooman Abediasl
  • Publication number: 20210141172
    Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Inventors: Yi Zhang, Chia-Te Chou, William Vis, Amit Singh Nagra, Hooman Abediasl