Abstract: The present disclosure provides methods, systems, and apparatuses for providing real time intraprocedural operational feedback to the operator as to the success of a renal denervation procedure and its overall effectiveness for reducing the blood pressure of a subject to allow for more precise and thorough ablation of the renal artery and better patient outcomes. Using this real time feedback generated through the electrical stimulation of multiple points about the circumference of the renal artery at specific times during the procedure, the operator can assess the desired procedural endpoint and whether the amount of renal denervation provided to the subject is sufficient, or whether the subject may benefit from further denervation of the renal artery. The present disclosure provides means for providing real time intraprocedural feedback to the operator that can be incorporated into conventional renal denervation catheters and equipment.

Abstract: An electronic system comprising a plurality of circuit boards and/or drives mounted in a stack within a housing. Interconnectors are provided between the circuit boards and/or drives to connect the circuit boards and/or drives and to provide vertical separations between the circuit boards and/or drives. A cooling fan is slidably disposed adjacent a wall of the housing to create a horizontal stream of air that flows through the separations and over the top and bottom surfaces of the circuit boards and/or the drives. This provides for convective cooling in an efficient manner, while minimizing the profile of the electronic system.

Abstract: An electronic system comprising a plurality of circuit boards and/or drives mounted in a stack within a housing. Interconnectors are provided between the circuit boards and/or drives to connect the circuit boards and/or drives and to provide vertical separations between the circuit boards and/or drives. A cooling fan is slidably disposed adjacent a wall of the housing to create a horizontal stream of air that flows through the separations and over the top and bottom surfaces of the circuit boards and/or the drives. This provides for convective cooling in an efficient manner, while minimizing the profile of the electronic system.