Abstract: An apparatus and method for separating a thin film from a substrate, the thin film having a surface with a selected width, includes an indenter for applying a force to the surface of the thin film that is substantially equal along the selected width. The forces are applied until separation of a portion of the thin film from the substrate occurs. In a preferred embodiment, the indenter is made from a block of material having a substantially flat surface engageable with the surface of the thin film. The substantially flat surface of the block of material has a width at least equal to the width of the surface of the thin film. Based on the two dimensional geometry of the mechanics, accurate analysis of work of adhesion is achieved.

Abstract: A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.

Abstract: A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.