Patents by Inventor William Walter Charles Badcock

William Walter Charles Badcock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8580869
    Abstract: The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing microballoons.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: November 12, 2013
    Assignee: Huntsman Advanced Materials LLC
    Inventors: Mahesh Kotnis, Elizabeth Louise Otloski, Paul Terrence Wombwell, William Walter Charles Badcock, Richard Martin Broad
  • Publication number: 20120214907
    Abstract: The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing mieroballoons.
    Type: Application
    Filed: April 19, 2012
    Publication date: August 23, 2012
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Mahesh Kotnis, Elizabeth Louise Otloski, Paul Terrence Wombwell, William Walter Charles Badcock, Richard Martin Broad
  • Patent number: 8182876
    Abstract: The invention relates to a seamless model free of bond lines and to a method of making same. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour. The modeling paste of the invention is a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming composition, which is preferably a polyurethane or epoxy froth-forming composition containing microballoons.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: May 22, 2012
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Mahesh Kotnis, Elizabeth Louise Otloski, Paul Terrence Wombwell, William Walter Charles Badcock, Richard Martin Broad
  • Publication number: 20040013865
    Abstract: The invention relates to a seamless model free of bond lines and to a method of making same. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour. The modeling paste of the invention is a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming composition, which is preferably a polyurethane or epoxy froth-forming composition containing microballoons.
    Type: Application
    Filed: July 10, 2003
    Publication date: January 22, 2004
    Inventors: Mahesh Kotnis, Elizabeth Louise Otloski, Paul Terrence Wombwell, William Walter Charles Badcock, Richard Martin Broad
  • Patent number: 5900204
    Abstract: A process for making a cured plastics moulding by introducing a curable resin composition to a heated mould and supplying further resin under pressure to compensate for shrinkage of the composition including heating the curable resin composition either before entry or as quickly as possible on entry into the mould, or both to a temperature which permits the satisfactory filling of the mould before gelation and subsequent progressive gel from the point furthest from entry, back to the point of the mould entry, and wherein the entry parts of the mould are heated to a temperature at least as high as the temperature of the final fill point of the mould.
    Type: Grant
    Filed: August 20, 1997
    Date of Patent: May 4, 1999
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Paul Terrence Wombwell, William Walter Charles Badcock, Marco Lucchi