Abstract: A method is provided in one example embodiment and includes receiving a dynamic host configuration protocol (DHCP) discovery signal at a wireless network element from a customer premise equipment; requesting that a data session be established at a gateway; receiving an Internet protocol (IP) address; and communicating the IP address to the customer premise equipment.

Abstract: A method is provided in one example embodiment and includes receiving a dynamic host configuration protocol (DHCP) discovery signal at a wireless network element from a customer premise equipment; requesting that a data session be established at a gateway; receiving an Internet protocol (IP) address; and communicating the IP address to the customer premise equipment.

Abstract: A method is provided in one example embodiment and includes receiving a dynamic host configuration protocol (DHCP) discovery signal at a wireless network element from a customer premise equipment; requesting that a data session be established at a gateway; receiving an Internet protocol (IP) address; and communicating the IP address to the customer premise equipment.

Abstract: A method is provided in one example embodiment and includes receiving a dynamic host configuration protocol (DHCP) discovery signal at a wireless network element from a customer premise equipment; requesting that a data session be established at a gateway; receiving an Internet protocol (IP) address; and communicating the IP address to the customer premise equipment.

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350.degree. C. to form thin films, possess properties such as low dielectric constant, low moisture absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.

Abstract: A process for making ethynylated, hydroxy-substituted biphenyl compounds comprising:a) halogenating 3,3'-dimethoxybiphenyl to form 2,2'-dihalo-5,5'-dimethoxybiphenyl;b) reacting the resulting 2,2'-dihalo-5,5'-dimethoxybiphenyl with a bromide-containing compound in a chlorinated solvent to form 2,2'-dihalo-5,5'-dihydroxybiphenyl;c) reacting the resulting 2,2'-dihalo-5,5'-dihydroxybiphenyl with a hydroxyl-containing compound in the presence of a protection catalyst to form 2,2'-dihalo-5,5'-bis(tetrahydropyranoxy)biphenyl;d) ethynylating the resulting 2,2'-dihalo-5,5'-bis(tetrahydropyranoxy)biphenyl with a compound of the formulaCuC.tbd.CR'wherein R' is comprised of an alkyl group having from about 1 to about 20 carbon atoms, an alkenyl group having from about 1 to about 20 carbon atoms, an aryl group, a heteroaryl group, or mixtures thereof to form 2,2'-bis(C.tbd.CR')-5,5'-bis(tetrahydropyranoxy)biphenyl; ande) hydrolyzing the resulting 2,2'-bis(C.tbd.

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350° C. to form thin films, possess properties such as low dielectric constant, low moisture absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.