Abstract: The embodiments herein relate to a method in a first unit for determining location of deteriorating hardware. The first unit obtains information indicating a first signal level of a first signal and a second signal level of a second signal transmitted over a wired communication link and over a period of time. The first unit monitors the first signal level and the second signal level over the period of time. When a deviation in the monitored signal levels has been detected, the first unit determines a location of the deteriorating hardware by comparing the deviation in monitored signal levels to known signal deviations for various locations of the deteriorating hardware. The location is in at least one of the wired communication link, the second unit and the third unit.

Abstract: A system is employed to mount an electronic component on a shelf. A first restraining device is associated with a support structure in a first location. The first restraining device is configured to operably engage a mating piece associated with the electronic component. The support structure is configured to guide an electronic component along an axis of insertion when introduced to the shelf. A second restraining device is associated with the support structure in a second location. The second restraining device is configured to secure the electronic component via one or more fastening elements.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: Manufacturable and serviceable packaging configurations for multi-cell array batteries. A cell alignment structure is provided for positioning and securing an array of electrochemical cells. An inner battery packaging assembly is also provided having the cell alignment structure, a base plate configured to be disposed below the cell alignment structure, and a removable cover configured to fit over the cell alignment structure and attach to the base plate. Furthermore, an outer battery packaging assembly is provided having the inner battery packaging assembly, an outer support plate configured to be disposed below the inner battery packaging assembly, a removable thermal insulating material surrounding the inner battery packaging assembly, and a removable outer battery cover configured to fit over the inner battery packaging and over the surrounding thermal insulating material and attach to the outer support plate.

Abstract: A system is employed to mount an electronic component on a shelf. A first restraining device is associated with a support structure in a first location. The first restraining device is configured to operably engage a mating piece associated with the electronic component. The support structure is configured to guide an electronic component along an axis of insertion when introduced to the shelf. A second restraining device is associated with the support structure in a second location. The second restraining device is configured to secure the electronic component via one or more fastening elements.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A system for functionally testing opto-electronic devices, such as fiber-optic infrared receiver photodiodes, in the integral wafer or other optical port-exposed status. The testing arrangement uses a portable optical probe for communicating optical signals between the testing apparatus and the tested device in coincidence with electrical energization and functional operation of the electro-optical device by the test apparatus. The optical probe signals may be correlated in time relationship or other manner with the electrical signals applied-to the device-under-test. The invention provides simple conversion between a conventional electrical semiconductor device probe station and an electro-optical device probe station.

Abstract: A photo FET device having a large area backside optical energy reception surface is disclosed. The photo FET device is fabricated in the source gate and drain upward configuration using a lattice determining surrogate substrate and a mesa-forming deep etch processing sequence and then inverted onto a new permanent substrate member and the surrogate substrate member removed in order to expose the active area backside optical energy reception surface. Fabrication of the device from two possible indium-inclusive semiconductor materials and a particular gate metal alloy is also disclosed.

Abstract: A photo FET device having a large area backside optical energy reception surface is disclosed. The photo FET device is fabricated in the source gate and drain upward configuration using a lattice determining surrogate substrate and a mesa-forming deep etch processing sequence and then inverted onto a new permanent substrate member and the surrogate substrate member removed in order to expose the active area backside optical energy reception surface. Fabrication of the device from two possible indium-inclusive semiconductor materials and a particular gate metal alloy is also disclosed.