Abstract: A mica-based electrically-conductive filler and reinforcing material, and methods of producing it. The material comprises milled mica particles and an electrically-conductive media such as carbon black or silver or copper adhered to the mica by a binder system. The material contributes both electrical conductivity and improved physical properties such as increased stiffness, increased tensile strength, and increased scratch resistance to materials for antistatic and electromagnetic shielding such as thermoplastic and thermosetting polymers, in a cost-effective manner relative to alternative prior art electrically-conductive and reinforcing materials.