Patents by Inventor William Weiser

William Weiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8995144
    Abstract: Embodiments of the present disclosure provide an assembly comprising circuitry of a wireless module disposed on a first region of a circuit board, and circuitry of a host controller module disposed on a second region of the circuit board. The first region is removably coupled to the second region.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: March 31, 2015
    Assignee: Marvell International Ltd.
    Inventor: William Weiser
  • Publication number: 20110038124
    Abstract: A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.
    Type: Application
    Filed: April 18, 2009
    Publication date: February 17, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Kikue S. Burnham, Lea Dankers, Martin William Weiser
  • Publication number: 20050018839
    Abstract: The present invention discloses an electronic device cradle organizer comprising a base, a plate adapted to be secured to a top portion of the base, and wiring positioned within the base.
    Type: Application
    Filed: July 23, 2003
    Publication date: January 27, 2005
    Inventor: William Weiser