Abstract: A radiator guard comprising a main body and a service panel; the main body being formed of mesh sheet material and comprising: a plurality of fastening points for mounting the main body over a rear face of a radiator of an internal combustion engine; a service aperture for providing access, in use, to the rear face of the radiator; and a plurality of retained fasteners arranged around a periphery of the service aperture; wherein the service panel is releasably mountable to the main body, to cover the service aperture, using the retained fasteners.

Abstract: A computer system for dynamically controlling a thermoset printer (100) may comprise one or more processors (210) and one or more computer-readable media having stored thereon executable instructions that when executed by the one or more processors, configure the computer system to perform various acts. The computer system may receive a thermoset printing data packet that comprises an indication of a desired final material property of the target object to be printed. The computer system may also receive an indication of one or more thermoset materials (250a,250b) that are available to the thermoset three-dimensional printer and access a material attribute dataset that describes different material properties. Based upon the material attribute dataset, the computer system may determine a particular mixture configuration for the one or more thermoset materials and generate a command to cause the thermoset three-dimensional printer to implement the particular mixture configuration.

Abstract: A computer system (110) for controlling a thermoset printer (100) to create desired material attributes comprises one or more processors (210) and one or more computer-readable media (220) having stored thereon executable instructions that when executed by the one or more processors configure the computer system to perform various acts. The computer system may receive an indication of one or more thermoset materials that are to be used by the thermoset printer (100) to print a target object (120). The computer system (110) may also access a material attribute dataset that describes different material properties of the one or more thermoset materials during printing. Based upon the material attribute dataset, the computer system determines a particular extrusion configuration for the one or more thermoset materials and generates a command to cause the thermoset printer to implement the particular extrusion configuration while printing the target object (120).

Abstract: A computer system for dynamically controlling a three-dimensional printer may comprise one or more processors and one or more computer-readable media having stored thereon executable instructions that, when executed by the one or more processors, configure the computer system to perform various acts. The computer system may receive an indication to cause a three-dimensional printer to print a non-planar surface. Additionally, the computer system may calculate multiple different bead sizes for creating the non-planar surface using components of the three-dimensional printer. The computer system may also create a command to generate the multiple different bead sizes at locations within a printing area.

Abstract: A method of forming patterned features on a substrate is provided. The method includes: positioning a first mask over a first portion of a substrate; directing radiation through the patterned area of the first mask at the first portion of the substrate to form a first patterned region on the substrate; positioning a second mask over a second portion of the substrate, the second mask including a first patterned area and a second patterned area, the first patterned area spaced apart from the second patterned area by an unpatterned area; directing radiation through the first patterned area of the second mask at a first part of the second portion of the substrate to form a second patterned region on the substrate; and directing radiation through the second patterned area of the second mask at a second part of the second portion of the substrate to form a third patterned region.

Abstract: Methods of forming a resist model for angled gratings on optical devices. In one example, a method includes designing a model with a model area and a verification area with initial mask patterns having a first grating pattern with a first angle and a first critical dimension and fabricating test masks with the model area having a first model angle and a first model critical dimension and the verification area having a first verification angle and a first verification critical dimension. The method also includes patterning a substrate with the test masks, measuring the first model angle, the first model critical dimension, the first verification angle and the first verification critical dimension, and fabricating a new device mask if the first verification angle is within the threshold range of the first desired angle and the first verification critical dimension is within the threshold range of the first desired critical dimension.

Abstract: A computer system for part production using flow infill design receives a computer-aided design file that describes physical dimensions of a target object (120). The computer system identifies a physical boundary portion (300) of the target object within the CAD file. The computer system generates a first tool path to additively manufacture the physical boundary portion (300). Additionally, the computer system sends instructions to a computer system in communication with a dispenser (130) that cause the dispenser to implement the first tool path while dispensing a boundary material. Further, the computer system generates a command to dispense the coreactive infill material (310) within the physical boundary portion.

Abstract: A computer system (110) for part production using additive design receives a computer-aided design (CAD) file that describes physical dimensions of a target object (120). The computer system (110) identifies a physical boundary portion (300) of the target object within the CAD file. The computer system determines a target flow rate to infill the physical boundary portion (300) with the infill material. Additionally, the computer system (110) generates a first tool path to flow infill material into the physical boundary portion (300). Further, the computer system (110) sends instructions to a computer system in communication with a dispenser (100) that cause the dispenser to implement the first tool path while flowing the infill material into the physical boundary portion (300).

Abstract: A system for reducing stray field effects comprises a magnetic target producing a changing magnetic field; a first set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a first magnetic field sensing element and a second magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; a second set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a third magnetic field sensing element and a fourth magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; and wherein the first set of magnetic field sensing elements is positioned closer to a center point of the magnetic field than the second set of magnetic field sensing elements.

Abstract: A system for reducing stray field effects comprises a magnetic target producing a changing magnetic field; a first set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a first magnetic field sensing element and a second magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; a second set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a third magnetic field sensing element and a fourth magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; and wherein the first set of magnetic field sensing elements is positioned closer to a center point of the magnetic field than the second set of magnetic field sensing elements.

Abstract: A system for reducing stray field effects comprises a magnetic target producing a changing magnetic field; a first set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a first magnetic field sensing element and a second magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; a second set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a third magnetic field sensing element and a fourth magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; and wherein the first set of magnetic field sensing elements is positioned closer to a center point of the magnetic field than the second set of magnetic field sensing elements.

Abstract: Methods for compensating for bow in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming an adhesion layer on the backside of the wafer, and forming a stress compensation layer on the adhesion layer.

Abstract: A system for reducing stray field effects comprises a magnetic target producing a changing magnetic field; a first set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a first magnetic field sensing element and a second magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; a second set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a third magnetic field sensing element and a fourth magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; and wherein the first set of magnetic field sensing elements is positioned closer to a center point of the magnetic field than the second set of magnetic field sensing elements.

Abstract: An integrated circuit device includes a package and at least two leads exposed external to the package to permit electrical connections to the package. A first die situated in the package has a first substrate and at least a first terminal electrically coupled to a first one of the leads. A second die situated in the package has a second substrate and at least a second terminal electrically coupled to a second one of the lead. An adhesive material holding the first and second die in place forms a voltage-triggered conduction path between the first and second die electrically that isolates the second die from the first die under a first condition and provides an ESD current path between the first one of the leads and the second one of the leads under a second condition.

Abstract: An integrated circuit device includes a package and at least two leads exposed external to the package to permit electrical connections to the package. A first die situated in the package has a first substrate and at least a first terminal electrically coupled to a first one of the leads. A second die situated in the package has a second substrate and at least a second terminal electrically coupled to a second one of the lead. An adhesive material holding the first and second die in place forms a voltage-triggered conduction path between the first and second die electrically that isolates the second die from the first die under a first condition and provides an ESD current path between the first one of the leads and the second one of the leads under a second condition.

Abstract: Methods for compensating for bow in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming an adhesion layer on the backside of the wafer, and forming a stress compensation layer on the adhesion layer.

Abstract: Methods for compensating for warpage in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming a buffer layer on the epitaxial layer and forming a compensating layer on the buffer layer; forming a buffer layer on the semiconductor substrate and forming a compensating layer on the buffer layer; and forming grooves in the epitaxial layer.

Abstract: A pipette component for use in performing an experimental procedure with a fluid sample and a pipette, the pipette component including: a pipette interface configured to engage sealingly and separably with a body of the pipette; a tip interface configured to engage sealingly and separably with a replaceable tip; and an experiment region configured to receive at least part of the fluid sample by operation of the pipette, and configured to perform at least part of the experimental procedure in the experiment region using the at least part of the fluid sample.

Abstract: A ground engaging work vehicle including a frame, a plurality of tractive elements, a movable extension, a hydraulic fluid using attachment, a hydraulic fluid pump and an accumulator. The plurality of tractive elements are coupled to the frame. The tractive elements engage the ground. The movable extension is connected to the frame. The hydraulic fluid using attachment is coupled to the movable extension. The hydraulic fluid pump is selectively fluidly coupled to the attachment. The accumulator is selectively fluidly coupled to the attachment dependent upon at least one fluid flow requirement of the attachment.

Abstract: A ground engaging work vehicle including a frame, a plurality of tractive elements, a movable extension, a hydraulic fluid using attachment, a hydraulic fluid pump and an accumulator. The plurality of tractive elements are coupled to the frame. The tractive elements engage the ground. The movable extension is connected to the frame. The hydraulic fluid using attachment is coupled to the movable extension. The hydraulic fluid pump is selectively fluidly coupled to the attachment. The accumulator is selectively fluidly coupled to the attachment dependent upon at least one fluid flow requirement of the attachment.