Abstract: A hands-free carrying device includes an elongated main body member having a top wall, a bottom wall, a first end, a second end and a pair of side walls. The bottom wall is curved to receive and engage the forearm of a user, and a connector is positioned along the top wall. The connector forms a releasable loop for engaging the handle of an infant carrier perpendicularly relative to the user's forearm and positions the seating area of the infant carrier parallel to the user's forearm. The device includes a moisture wicking outer layer, a padded middle layer, and a rigid inside layer. The outer layer is removeable, and the connectors are secured directly onto the inside layer and extend through openings in the middle and outer layers.

Abstract: An Internet of Things (IoT) device is deployed with embedded software that may comprise multiple components. After deployment, updated versions of one or more components of the embedded software may become available. The IoT device maintains a manifest of the installed components. Periodically, the IoT device requests an updated copy of the manifest from an upgrade server. The installed manifest and the updated manifest are compared to determine if updated versions of any components are available. If so, the IoT device requests only the components to be updated. Prior to beginning the copying of the upgraded components, an upgrade flag is set. The IoT device then begins copying the received components into memory, replaces the manifest with the updated manifest, and clears the upgrade flag.

Abstract: A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.