Abstract: A method for testing the tightness of a housing involves providing a pressure sensor in a housing, sealing the housing, and detecting a pressure level in the housing.

Abstract: A method for testing the tightness of a housing involves providing a pressure sensor in a housing, sealing the housing, and detecting a pressure level in the housing.

Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

Abstract: A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means (9) for conveying a circuit carrier from the placing location (17) to a take-over location (29) of the fixing station (19). The fixing station (19) comprises a heatable zone (22) and a manipulator (21) for raising the circuit carrier (1) from the take-over location (29) and placing it in the heatable zone (22). A continuous belt conveyor (9) of the belt conveyor means extends from the placing location (17) up to the take-over location (29).

Abstract: An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

Abstract: For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.

Abstract: In the assembly of an electronic circuit module having a baseplate (10) and circuit components (16, 19, 21) mounted on said baseplate in an automatic assembly line in which a boat is placed on a conveyor means and is conveyed between various assembly stations in order to place, fix and/or contact the circuit components (16, 19, 21) on the boat, the boat is used as the baseplate (10) of the circuit module. When the circuit module is finished, the boat thus becomes part of a device where the module is built in.

Abstract: A circuit assembly comprises a circuit board, at least one circuit component connected to the circuit board by wire bonding, and a base plate, on which the circuit board is fixed. A gap between the base plate and the circuit board fixed to it is filled at least locally by a filling body made of a material hardened in the gap.

Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

Abstract: A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means (9) for conveying a circuit carrier from the placing location (17) to a take-over location (29) of the fixing station (19). The fixing station (19) comprises a heatable zone (22) and a manipulator (21) for raising the circuit carrier (1) from the take-over location (29) and placing it in the heatable zone (22). A continuous belt conveyor (9) of the belt conveyor means extends from the placing location (17) up to the take-over location (29).

Abstract: A method of gluing a circuit component onto a circuit board. The circuit component has a bottom area with at least one edge for bringing into contact with the circuit board. The distance between the edge and a first line parallel to the edge and an amount of adhesive to be applied per length unit along the line are determined such that, when placing the circuit component on the circuit board,the adhesive advances to the edge but not to a second circuit component adjacent to the edge. The adhesive is applied in the selected quantity along the first line and along further lines which are parallel to the first line and further away from the edge. Then, the circuit component is placed on the circuit board.

Abstract: In a procedure for automatically placing components of a circuit on a base plate based on predefined position data, the position of at least one first reference mark formed at the base plate is detected. A target position for placing a substrate on the base plate is calculated based on the detected position of the first reference mark and the position data, and the substrate is placed at the calculated position. The position of at least one second reference mark formed at the substrate is detected and a target position for placing a further component on the substrate is calculated based on the detected position of the second reference mark and the position data predefined for said component, and the component is placed at the calculated target position.

Abstract: In the assembly of an electronic circuit module having a baseplate and circuit components mounted on the baseplate in an automatic assembly line in which a boat is placed on a conveyor and is conveyed between various assembly stations in order to place, fix and/or contact the circuit components on the boat, the boat is used as the baseplate of the circuit module. When the circuit module is finished, the boat thus becomes part of a device where the module is built in.

Abstract: An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

Abstract: A device for assembling electronic circuits comprises a placing station for placing circuit components on a circuit carrier held at a placing location, a fixing station for fixing the circuit carrier under the effect of heat, and a belt conveyor for conveying a circuit carrier from the placing location to a take-over location of the fixing station. The fixing station comprises a heatable zone and a manipulator for raising the circuit carrier from the take-over location and placing it in the heatable zone. A continuous belt conveyor extends from the placing location up to the take-over location.

Abstract: An adhesive-dispensing method applies a pattern of adhesive onto a circuit-board carrier such that any discontinuities in the pattern, i.e. starting-points, end-points or turning-points, are outside a footprint of a pair of substrates or MMICs intended to be attached, adjacent each other and spaced apart, to the circuit-board, and in particular outside such footprint in the area of transition between one substrate/MMIC and the other. The adhesive is preferably applied in straight lines and in a direction substantially transverse to the direction of transition between the two substrates/MMICs.

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.

Abstract: A frequency-generator circuit employs the same circuit element (preferably a varactor) to perform the functions of parametric frequency-divider and frequency-adjustment element for an oscillator used to pump the parametric frequency-divider. The varactor preferably has a flat gamma-characteristic (gamma preferably >2) over a required bias-voltage adjustment range corresponding to the required frequency-adjustment range.

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.

Abstract: A screening housing for microwave circuits has a housing body having an interior and open at least at one side, a cover closing the interior of the housing, and means forming a plurality of chambers provided for accommodating of individual circuit units and screened from one another, the means including a substrate and applied on an inner side of the cover and a plurality of webs which are formed on the substrates so that when the cover closes the housing the webs form separating walls between the chambers.