Patents by Inventor Willie Davis

Willie Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240225266
    Abstract: The desk-edge keeper keeps devices like laptop computers and keyboards at the edge of the desktop, in a fixed position and in place, so the user does not spend time repositioning every time they bump, shift or brace against the device.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 11, 2024
    Inventor: Willie Davis
  • Publication number: 20210213489
    Abstract: A portable tool for simultaneously shaving, scraping or cleaning the outer circumference of pipe has a drill shaft that connects the tool to a power source. The drill shaft has a gear wheel attached to an inner end. This drift shaft engages a circular ban to form a gear assembly that will enable the ban to rotate when power is applied to the drill shaft. Connected to the inner wall of the circular ban is a plurality of bristles that will engage the surface of a pipe. After a pipe is inserted into the tool and power applied to the tool the drill shaft and circular ban will begin to rotate. As the ban rotates, the bristles will move over the surface of the pipe thereby performing the cleaning activity on the pipe's outer surface. During the cleaning process, the user can move the pipe linearly through the tool and clean the entire length of the pipe.
    Type: Application
    Filed: January 14, 2020
    Publication date: July 15, 2021
    Inventor: Willie Davis
  • Publication number: 20070148816
    Abstract: Methods and arrangements to attach a QFN to a PCB, systems which include a QFN attached to a PCB, and apparatuses for controlling the deposit of solder upon a PCB are disclosed. Embodiments include transformations, code, state machines or other logic to calculate a total area for the QFN IO pads. Embodiments may then determine a total area for the regions of solder applied to the PCB thermal pad to which the QFN thermal pad may be connected in dependence upon the calculated total area for the QFN IO pads. In some embodiments, the total area of the solder regions applied to the PCB thermal pad is approximately equal to the calculated total area for the QFN IO pads. In many embodiments, the number of regions of solder and the shape of the regions of solder is determined.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Applicant: International Business Machines Corporation
    Inventors: Willie Davis, Todd Fellows, Larry Gross