Patents by Inventor Willie Fowlkes

Willie Fowlkes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High speed solder deposition and reflow for a printed flexible electronic medium
    Patent number: 10356913
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 16, 2019
    Assignee: CCL Label, Inc.
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
    Publication number: 20180332716
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Application
    Filed: July 26, 2018
    Publication date: November 15, 2018
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • High speed solder deposition and reflow for a printed flexible electronic medium
    Patent number: 10064289
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 28, 2018
    Assignee: CCL Label, Inc.
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
    Publication number: 20170311454
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Application
    Filed: April 26, 2017
    Publication date: October 26, 2017
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek