Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

Abstract: A device and method for aligning and assembling castellated chip carriers with other electrical components such as printed circuit boards or other chip carriers is disclosed. The device provides means for compressively engaging the castellations in the chip carrier thereby providing precise alignment and positioning of the chip carriers relative to other components with which it is assembled. A method utilizing the device and a solder column placement device to produce a pre-leaded castellated chip carrier is also disclosed.

Abstract: A solder delivery system has a continuous element of solder material adjacent to at least one polymeric layer, which is provided with window means to control the flow of solder. The layers, if there are more than one, may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed adjacent to corresponding terminals of a substrate and the system placed in contact with and perpendicular to the conductors, with the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.

Abstract: A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.