Patents by Inventor Willliam Lonzo Woods, JR.

Willliam Lonzo Woods, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130092721
    Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 18, 2013
    Applicant: GENERAL ELECTRIC
    Inventors: John Andrew Trelford, Willliam Lonzo Woods, JR., Thang Dahn Truong