Patents by Inventor Willliam M. Stone

Willliam M. Stone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for connecting a semiconductor die to a substrate and method therefor
    Publication number: 20020079595
    Abstract: A pad area of a substrate (50) includes a conductive trace (52) formed on the substrate (50) having a first surface area, the first surface area being of a first solderability. A conductive pad (56) is formed on the first surface area of the conductive trace (52). The conductive pad (56) has a second surface area, the second surface area being of a second solderability. The second solderability is greater than the first solderability. Because of the different solderabilities, a solder bump (46) on the semiconductor die (40) can be reflowed and connected to the second surface area without using a soldermask (28) to contain the melted solder on the second surface area.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 27, 2002
    Inventors: Burton J. Carpenter, Nhat D. Vo, Christopher T. Clark, Willliam M. Stone, Trent S. Uehling, David B. Clegg