Abstract: The invention relates to a method of forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, wherein two different atomic species are co-implanted under certain conditions into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred. The two different atomic species are implanted so that their peaks have an offset of less than 200 ? in the donor substrate, and the substrates are bonded together after roughening at least one of the bonding surfaces.

Abstract: The present invention provides improved methods for fabricating compound-material wafers, in particular a silicon on insulator type wafer. The improved methods lead to reduced numbers of deflects arising on or near the periphery of the wafers. In a first method, wafers are selected in dependence on edge roll off values determined at about 0.5-2.5 mm away from the edge of the wafer, where edge roll off values are determined in dependence on the second derivative of the wafer height profiles. In a second method, wafers selected according to the first method are further processed by bonding, forming a splitting layer, and detaching the two wafers at the splitting layer.

Abstract: The invention relates to a method of forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, wherein two different atomic species are co-implanted under certain conditions into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred. The two different atomic species are implanted so that their peaks have an offset of less than 200 ? in the donor substrate, and the substrates are bonded together after roughening at least one of the bonding surfaces.

Abstract: The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.

Abstract: The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.

Abstract: The present invention provides improved methods for fabricating compound-material wafers, in particular a silicon on insulator type wafer. The improved methods lead to reduced numbers of deflects arising on or near the periphery of the wafers. In a first method, wafers are selected in dependence on edge roll off values determined at about 0.5-2.5 mm away from the edge of the wafer, where edge roll off values are determined in dependence on the second derivative of the wafer height profiles. In a second method, wafers selected according to the first method are further processed by bonding, forming a splitting layer, and detaching the two wafers at the splitting layer.

Abstract: The invention provides a device and methods for analysing body fluids wherein the device is implanted in the body and provides for both the delivery of substances into the body and for the testing of body fluids.

Abstract: The device for measuring and displaying the concentration of glucose in the blood comprises a display device (2) into which disposable sensors (1) comprising a biomembrane (9) can be inserted. The display device (2) comprises a built-in computer (3) in whose memory (7) a glucose concentration diagram (5) is stored and which can evaluate the measurement results of the sensors (1). The computer (3) comprises a time measuring device (4) whose zero setting can be correlated in an irreversible manner with the date of manufacture of the disposable sensors (1). Before the device is supplied to the patient, the glucose concentration diagram, which corresponds to the characteristics of the biomembrane (9) of the disposable sensors (1) at the time of manufacture, is irreversibly calibrated. The glucose concentration diagram is automatically and irreversibly corrected, taking into account the time-dependent characteristics of the biomembrane (9) of the disposable sensors (1), by means of the time measuring device (4).

Abstract: A fastening mechanism for a needle system with the liquid system being a cartridge ampoule (4) and with a needle holder (3). The needle holder (3) is snapped onto the cartridge ampoule (4) or a cartridge ampoule holder containing the cartridge ampoule (4) by means of a snap-in closure means. The fastening mechanism of the invention allows sanitary application of injected medicines.