Abstract: A new method is provided for exposing a semiconductor surface over which a photoresist mask has been created to elevated temperatures. Using conventional methods of wafer temperature exposure, the wafer is mounted on the surface of a hot plate with the active surface of the wafer, over which the photoresist mask has been created, facing upwards. The invention provides a method whereby the conventional upward position of the wafer during temperature exposure is changed. The wafer is, during temperature exposure, placed on the surface of a hot plate, the hot plate is then positioned under an angle with a horizontal direction and may, under the invention, be turned such that the active surface of the wafer, over which a photoresist mask has been formed, faces downwards.

Abstract: A method and system for detecting contaminants during a semiconductor fabrication operation involving a semiconductor-coating device. A beam of laser light is generated from a laser light source attached to at least one coater cup associated with the semiconductor coating device utilized in the semiconductor fabrication operation. The semiconductor fabrication operation may then be automatically terminated in response to detecting the contaminants utilizing the beam of laser light. The laser light source may be configured as one or more laser generators and/or laser detectors. Such a method and system can thus be implemented to detect photoresist (PR) dust, which is scattered during wafer coating operations.

Abstract: A new method is provided for exposing a semiconductor surface over which a photoresist mask has been created to elevated temperatures. Using conventional methods of wafer temperature exposure, the wafer is mounted on the surface of a hot plate with the active surface of the wafer, over which the photoresist mask has been created, facing upwards. The invention provides a method whereby the conventional upward position of the wafer during temperature exposure is changed. The wafer is, during temperature exposure, placed on the surface of a hot plate, the hot plate is then positioned under an angle with a horizontal direction and may, under the invention, be turned such that the active surface of the wafer, over which a photoresist mask has been formed, faces downwards.

Abstract: A semiconductor design patternable on a semiconductor wafer for improved detection of out-of-focus conditions during lithographic processing is disclosed. The semiconductor design includes a central main body, and at least one arm extending from sides of the central main body. Each arm has a first one or more at least substantially triangular shapes, and a disconnected second one or more at least substantially triangular shapes. A tip of the first shapes is positioned opposite a tip of the second shapes, such that a gap there between is formed. The gap is sensitive to out-of-focus conditions during lithographic processing, where the gap increases as defocus increases. Increasing of the gap as defocus increases is preferably automatically detectable by semiconductor test equipment.

Abstract: A new method is provided for exposing a semiconductor surface over which a photoresist mask has been created to elevated temperatures. Using conventional methods of wafer temperature exposure, the wafer is mounted on the surface of a hot plate with the active surface of the wafer, over which the photoresist mask has been created, facing upwards. The invention provides a method whereby the conventional upward position of the wafer during temperature exposure is changed. The wafer is, during temperature exposure, placed on the surface of a hot plate, the hot plate is then positioned under an angle with a horizontal direction and may, under the invention, be turned such that the active surface of the wafer, over which a photoresist mask has been formed, faces downwards.

Abstract: A method and system for detecting contaminants during a semiconductor fabrication operation involving a semiconductor-coating device. A beam of laser light is generated from a laser light source attached to at least one coater cup associated with the semiconductor coating device utilized in the semiconductor fabrication operation. The semiconductor fabrication operation may then be automatically terminated in response to detecting the contaminants utilizing the beam of laser light. The laser light source may be configured as one or more laser generators and/or laser detectors. Such a method and system can thus be implemented to detect photoresist (PR) dust, which is scattered during wafer coating operations.

Abstract: A semiconductor design patternable on a semiconductor wafer for improved detection of out-of-focus conditions during lithographic processing is disclosed. The semiconductor design includes a central main body, and at least one arm extending from sides of the central main body. Each arm has a first one or more at least substantially triangular shapes, and a disconnected second one or more at least substantially triangular shapes. A tip of the first shapes is positioned opposite a tip of the second shapes, such that a gap there between is formed. The gap is sensitive to out-of-focus conditions during lithographic processing, where the gap increases as defocus increases. Increasing of the gap as defocus increases is preferably automatically detectable by semiconductor test equipment.