Patents by Inventor Wilmer F. Borger

Wilmer F. Borger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PECVD air gap integration
    Patent number: 7009272
    Abstract: A series of conductive layers separated by interlayer gaps is formed adjacent a substrate layer, the conductive layer and interlayer gap dimensions defining aspect ratios for trenches between the conductive layers. A layer of dielectric material is deposited over the conductive layers using plasma enhanced chemical vapor deposition. Trenches having aspect ratios within specified geometric categories are incompletely filled, leaving interlayer voids which may have desirable dielectric properties.
    Type: Grant
    Filed: December 28, 2002
    Date of Patent: March 7, 2006
    Assignee: Intel Corporation
    Inventors: Wilmer F. Borger, Jeffrey T. West, Ebrahim Andideh
  • PECVD air gap integration
    Publication number: 20040124446
    Abstract: A series of conductive layers separated by interlayer gaps is formed adjacent a substrate layer, the conductive layer and interlayer gap dimensions defining aspect ratios for trenches between the conductive layers. A layer of dielectric material is deposited over the conductive layers using plasma enhanced chemical vapor deposition. Trenches having aspect ratios within specified geometric categories are incompletely filled, leaving interlayer voids which may have desirable dielectric properties.
    Type: Application
    Filed: December 28, 2002
    Publication date: July 1, 2004
    Inventors: Wilmer F. Borger, Jeffrey T. West, Ebrahim Andideh