Abstract: An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

Abstract: An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

Abstract: A flexible DUT interface assembly is presented. The DUT interface assembly includes a DUT interface board with a plurality of slots to accommodate inserted circuit cards for providing a plurality of different test functions, a socket adapter card to accommodate a plurality of DUTs via a plurality of sockets and to provide the interface between the DUTs and the DUT interface board, and an interposer to provide the required space for the inserted circuit cards between the DUT interface board and a test head module. The modular characteristics of the assembly parts (i.e., DUT interface board, socket adapter, and interposer) and their sub-components allows configuration (e.g., DUTs, test functions, etc.) and repair to be rapidly and easily carried out. The interposer allows external environmental factors around close-coupled instruments, such as temperature, humidity, and electrical noise, to be easily monitored and controlled.