Patents by Inventor Wilson Leung

Wilson Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8350375
    Abstract: Disclosed is a flipchip scheme where power and ground bumps are arranged in a striped configuration. Specifically, there are a plurality of lines of power bumps, and a plurality of lines of ground bumps. Each line of power bumps is interconnected by a mesh core power bus, and each line of ground bumps is interconnected by a mesh core ground bus. The busses are shorted across the bumps without having to use metal tab extensions. This arrangement provides that: signal routing can be provided between the lines of bumps; and/or the mesh core power busses can be provided as being wider in order to provide improved power mesh performance and/or in order to reduce or eliminate the metal required on the second top-most metal layer.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: January 8, 2013
    Assignee: LSI Logic Corporation
    Inventors: Anwar Ali, Kalyan Doddapaneni, Wilson Leung
  • Patent number: 8115321
    Abstract: An integrated circuit includes a number of probe pads arranged in a staggered manner in a core region of the integrated circuit and a number of bond pads in an Input/Output (I/O) region surrounding the core region. The core region includes logic circuitry therein, and the I/O region is configured to enable the core region to communicate with one or more external circuit(s) through the number of bond pads. The integrated circuit also includes a die metal interconnect separating a bond pad area in the I/O region from a probe pad area in the core region. A dimension of the die metal interconnect and/or a position of the die metal interconnect between the probe pad area and the bond pad area is variable.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: February 14, 2012
    Assignee: LSI Corporation
    Inventors: Anwar Ali, Kalyan Doddapaneni, Gokulnath Sulur, Wilson Leung, Tauman T Lau
  • Publication number: 20100276816
    Abstract: Disclosed are a system and method of separate probe and bond regions of an integrated circuit (IC). An IC, an I/O region adjacent to the core region to enable the core region, and a die metal interconnect separating a bond pad area in the I/O region from a probe pad area outside the I/O region of the IC are disclosed. The die metal interconnect may have a length that is greater than the bond pad area length and/or the probe pad area length, and a width that is less than the bond pad area width and/or the probe pad area width. An in-front staggering technique may be used at a die corner of the IC to maintain the bond pad area in the I/O region, and a side staggering technique may be used at the die corner of the IC to maintain the bond pad area in the I/O region.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Inventors: ANWAR ALI, Kalyan Doddapaneni, Gokulnath Sulur, Wilson Leung, Tauman T. Lau
  • Publication number: 20090283904
    Abstract: Disclosed is a flipchip scheme where power and ground bumps are arranged in a striped configuration. Specifically, there are a plurality of lines of power bumps, and a plurality of lines of ground bumps. Each line of power bumps is interconnected by a mesh core power bus, and each line of ground bumps is interconnected by a mesh core ground bus. The busses are shorted across the bumps without having to use metal tab extensions. This arrangement provides that: signal routing can be provided between the lines of bumps; and/or the mesh core power busses can be provided as being wider in order to provide improved power mesh performance and/or in order to reduce or eliminate the metal required on the second top-most metal layer.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 19, 2009
    Applicant: LSI LOGIC CORPORATION
    Inventors: Anwar Ali, Kalyan Doddapaneni, Wilson Leung
  • Publication number: 20050071051
    Abstract: A car audio/video equipment has a chassis including a front side having a bottom part, a playing mechanism provided in the chassis, and a control panel provided on the chassis front side for operating the playing mechanism. The control panel has a bottom part detachably hinged to that of the chassis front side such that the panel is pivotable between an upward position lying flat on the chassis front side and a downward position extending therefrom for operation. An infrared wireless link is provided between the control panel and the playing mechanism such that the playing mechanism is operable by the control panel when the panel is detached from the chassis, acting as a remote controller.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 31, 2005
    Applicant: Alco Electronics Limited
    Inventor: Wilson Leung
  • Publication number: 20050024995
    Abstract: A multiple disc player comprises a turntable for holding twenty discs upright in an annular arrangement, a playing mechanism for playing a selected disc from the turntable, and a disc slider for moving the selected disc from the turntable to the playing mechanism and later back to the turntable. A motor-driven drive mechanism operates the turntable, the playing mechanism and the disc mover. The turntable includes twenty disc brackets for supporting the discs thereon respectively, each support being slidable radially from and to the turntable. The disc slider is releasably engageable with a disc support supporting the selected disc for moving the disc by the support.
    Type: Application
    Filed: August 1, 2003
    Publication date: February 3, 2005
    Applicant: Alco Electronics Limited
    Inventor: Wilson Leung
  • Patent number: 4768510
    Abstract: A pacifier is provided for infants. The pacifier includes a nipple, a flexible bulb handle which extends away from the nipple and a shield located between the nipple and the flexible bulb. A whistle is securely mounted to the pacifier by the shield and is located within the flexible bulb handle. When the handle is squeezed, air passes through the whistle to provide a whistle or squeeking sound.
    Type: Grant
    Filed: January 21, 1987
    Date of Patent: September 6, 1988
    Inventor: Wilson Leung
  • Patent number: D297032
    Type: Grant
    Filed: August 18, 1986
    Date of Patent: August 2, 1988
    Assignee: Spalding & Evenflo Companies, Inc.
    Inventor: Wilson Leung
  • Patent number: D301596
    Type: Grant
    Filed: May 27, 1986
    Date of Patent: June 13, 1989
    Assignee: Spalding & Evenflo Companies, Inc.
    Inventor: Wilson Leung
  • Patent number: D301931
    Type: Grant
    Filed: May 27, 1986
    Date of Patent: June 27, 1989
    Assignee: Spalding & Evenflo Companies, Inc.
    Inventor: Wilson Leung