Patents by Inventor Wilson O. W. San

Wilson O. W. San has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring boards with superposed copper foils cores
    Patent number: 5045642
    Abstract: The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.
    Type: Grant
    Filed: April 17, 1990
    Date of Patent: September 3, 1991
    Assignees: Satosen, Co., Ltd., Hewlett-Packard Company
    Inventors: Hideo Ohta, Kenji Miyamoto, Wilson O. W. San, Alfred M. Martini