Abstract: An electronic device substrate handling system. The system comprises an electronic device fabrication tool and a mechanical handling structure. The fabrication tool is configured to hold at least one substrate on a mounting body of the tool. The mechanical handling structure is configured to actuate the substrate such that the substrate is transferred to or from the mounting body. The system further comprises a vibration monitor coupled to at least one of the mechanical handling structure, or, the tool. The vibration monitor is configured to measure vibrations of the mechanical handling structure, or, the tool, while said mechanical handling structure is actuating said substrate. The vibration monitor is also configured to convert the measured vibrations into a time-dependent electrical signal.