Patents by Inventor Wim van den Einden

Wim van den Einden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device forming method and device with MEMS structure
    Patent number: 8766380
    Abstract: A method of forming a MEMS device by encapsulating a MEMS element with a sacrificial layer portion deposited over a substrate arrangement, the portion defining a cavity for the MEMS element, forming at least one strip of a further sacrificial material extending outwardly from the portion, forming a cover layer portion over the sacrificial layer portion, the cover layer portion terminating on the at least one strip, removing the sacrificial layer portion and the at least one strip, the removal of the at least one strip defining at least one vent channel extending laterally underneath the cover layer portion and sealing the at least one vent channel. A device including such a packaged micro electro-mechanical structure.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: July 1, 2014
    Assignee: NXP, B.V.
    Inventors: Michael Antoine Armand in 't Zandt, Wim van den Einden, Harold Roosen
  • Microscopic structure packaging method and device with packaged microscopic structure
    Patent number: 8330238
    Abstract: A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: December 11, 2012
    Assignee: NXP B.V.
    Inventors: Johannes van Wingerden, Wim van den Einden, Harold H. Roosen, Greja Johanna Adriana Maria Verheijden, Gerhard Koops, Didem Ernur, Jozef Thomas Martinus van Beek
  • MEMS DEVICE FORMING METHOD AND DEVICE WITH MEMS STRUCTURE
    Publication number: 20120153408
    Abstract: A method of forming a MEMS device by encapsulating a MEMS element with a sacrificial layer portion deposited over a substrate arrangement, the portion defining a cavity for the MEMS element, forming at least one strip of a further sacrificial material extending outwardly from the portion, forming a cover layer portion over the sacrificial layer portion, the cover layer portion terminating on the at least one strip, removing the sacrificial layer portion and the at least one strip, the removal of the at least one strip defining at least one vent channel extending laterally underneath the cover layer portion and sealing the at least one vent channel. A device including such a packaged micro electro-mechanical structure.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 21, 2012
    Applicant: NXP B.V.
    Inventors: Michael Antoine Armand in 't Zandt, Wim van den Einden, Harold Roosen
  • MEMS resonator
    Patent number: 8143971
    Abstract: A MEMS resonator, comprising a planar resonator body formed of two different materials with opposite sign temperature coefficient of Young's modulus. A first portion of one material extends across the full thickness of the resonator body. This provides a design which allows reduced temperature drift.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: March 27, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jozef Thomas Beek, Johannes van Wingerden, Wim van den Einden, Kim Phan Le, Gerhard Koops, Cas van der Avoort
  • MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE
    Publication number: 20110175178
    Abstract: A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
    Type: Application
    Filed: November 23, 2010
    Publication date: July 21, 2011
    Applicant: NXP B.V.
    Inventors: Johannes van WINGERDEN, Wim van den EINDEN, Harold H. ROOSEN, Greja Johanna Adriana Maria VERHEIJDEN, Gerhard KOOPS, Didem ERNUR, Jozef Thomas Martinus van BEEK
  • MEMS RESONATOR
    Publication number: 20100026421
    Abstract: A MEMS resonator, comprising a planar resonator body formed of two different materials with opposite sign temperature coefficient of Young's modulus. A first portion of one material extends across the full thickness of the resonator body. This provides a design which allows reduced temperature drift.
    Type: Application
    Filed: July 10, 2009
    Publication date: February 4, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jozef Thomas BEEK, Johannes Van WINGERDEN, Wim Van den EINDEN, Kim Phan LE, Gerhard KOOPS, Cas Van der AVOORT