Abstract: A heat sink mount including a body, a first operating member, and two second operating members is provided. The body is formed with a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side and connecting the first side and the second side. One end of the first operating member is pivotally attached to the first side of the body, and the other end thereof is rotatably coupled to the second side of the body. The first operating member further includes a second positioning portion and a third positioning portion. Each of the second operating members is pivotally attached to the third side and the fourth side of the body respectively and fixed in position by the second positioning portion and the third positioning portion respectively.

Abstract: A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating component is pivotally disposed on the retaining component and pivotally rotated between a release position and a locking position. When the rotating component is at the locking position, a clamping portion of the rotating component is snapped onto the chip unit and presses the retaining component against the heat sink and the chip unit, thus improving the stability, reliability and fastness of the integral combination and meanwhile achieving the goal of being extremely convenient in assembling or disassembling.

Abstract: An elastic engaging element engages a second component with a first component. The engaging element includes an elastic coil having a first end and a second end having an exterior diameter at least larger than a second diameter of a through hole of the second component, an extension wire extending from the first end of the elastic coil, passing through the whole elastic coil, and to the second end of the elastic coil, and a hooking portion integrated with the extension wire and located in a region outside of the elastic coil, the hooking portion having a contour size at least larger than a first diameter of a through hole of the first component and being capable of elastically deformed and passing through the through holes of the first and second components and then hooking up to a top surface of the first component.

Abstract: A heatsink-locking device that is applied to lock a heatsink to a placement surface having an exothermic component, includes a bottom base fixed on the placement surface to dispose and position the heatsink and having an open hole corresponding to the exothermic component and clamping portions at two opposing lateral sides; and a clamping tool for pressing the heatsink and being jointed to the bottom base, the clamping tool including a first board part and a second board part connected to each other with a distance between these two parts being adjustable, a third board part axially connected to the first board part to fix the adjustable distance, a pressing part fixed to the third board part to press the heatsink, and a first joint part and a second joint part disposed at one end of the first and second board parts respectively to be jointed to the clamping portion.

Abstract: An axial induction motor structure including a case, a rotor, and a stator is provided. The rotor is pivoted on the case by a shaft and includes a ring-magnetic section. The ring-magnetic section is composed of a plurality of magnet-conducting parts. The adjacent magnet-conducting parts have different magnetic polarities. The stator and the rotor are co-axially stacked. In addition, the stator has a plurality of magnet-generating parts corresponding to the magnet-conducting parts. When the magnet-generating parts are conducted, the magnet-generating parts generate the magnetic polarities different from those of the magnet-conducting parts periodically, such that the rotor is rotated. Thus, the radial length of the axial induction motor is reduced so as to decrease the overall volume and to reduce production cost.

Abstract: A heatsink structure including a heat conductor is provided. The heat conductor has a first surface and a second surface. A plurality of heatsink fins is erected on the first surface, and the second surface is attached to a heat-generating element of a printed circuit board (PCB). A pair of fixing posts passing through the PCB is disposed on the second surface. An elastic element is sleeved on each of the fixing posts, and a buckling piece is disposed at one end of each of the fixing posts. The elastic element is pressed between the PCB and the buckling piece, such that the heat conductor tightly contacts the heat-generating element to conduct heats.

Abstract: A motor structure including a revolving shaft, internal stators, middle rotors, and external stators is provided. The revolving shaft is an axle center, and the internal stators, middle rotors, and external stators are arranged in an outward radial direction. The middle rotors are circularly disposed with magnetic segments, and the poles of adjacent magnetic segments are unlike. Besides, the internal stators are circularly disposed with magnetic generating sections having the like pole and alternatively corresponding to the magnetic segments. The external stators are disposed with magnetic corresponding sections corresponding to the magnetic segments one by one. Moreover, the pole of the magnetic corresponding sections that correspond to the magnetic generating sections is the same as that of the magnetic generating sections.

Abstract: A method for combining a heat pipe with a heat sink fin is provided, which includes the following steps: firstly, providing a heat sink fin with an opening, next, installing the heat pipe and a tin pipe into the opening, and installing the heat pipe into the tin pipe, and then, carrying out a heat treatment, so as to combine the heat pipe with the heat sink fin via the melted tin pipe.

Abstract: An airflow generating apparatus is provided. Fan blades are disposed around a hub, and one side of a fan blade is partially fixed on the peripheral of the hub, and another portion not fixed on the peripheral side of the hub is a free portion swinging with airflow. Therefore, the airflow generating apparatus employing the fan blades can adjust the swaying angle in accordance with the variation of different flow fields, so as to maintain a smooth airflow.

Abstract: This present invention provides a heat-dissipating element for dissipating heat generated by a heat source in an electronic apparatus. The heat-dissipating element includes a contacting portion, an extending portion having one end connected with the contacting portion, and a chamber connected with the contacting portion and the extending portion. The chamber is filled with a working fluid and comprises a plurality of capillary structures to which the working fluid is adhered, and one end of the contacting portion contacts with the heat source to absorb the heat generated from operation while the extending portion extends in a direction away from the heat source, such that heat generated from the heat source can be conducted into the extending portion and away from the heat source, thereby facilitating heat convection with the ambient cool air and enhancing heat-dissipation efficiency.

Abstract: A heat sink fixing device has an enclosing frame socket having a central part for disposing a heat generating unit of an electronic device thereon, with a heat sink mounted on the enclosing frame socket and covering the heat generating unit. A first fixing part is provided on a bottom surface of the heat sink, and a second fixing part corresponding to the first fixing part of the heat sink is provided on the enclosing frame socket, allowing the heat sink to be coupled to the frame socket by coupling the first fixing part of the heat sink with the second fixing part of the frame socket, thereby substantially maximizing heat dissipating area on the heat sink.

Abstract: A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating component is pivotally disposed on the retaining component and pivotally rotated between a release position and a locking position. When the rotating component is at the locking position, a clamping portion of the rotating component is snapped onto the chip unit and presses the retaining component against the heat sink and the chip unit, thus improving the stability, reliability and fastness of the integral combination and meanwhile achieving the goal of being extremely convenient in assembling or disassembling.

Abstract: A vacuum adsorbing apparatus for fan positioning is provided, which includes a fixing frame and a vacuum aspirator. The fixing frame has a workpiece holder to provide close arrangement for the fan, and a through-hole connected with the vacuum aspirator is disposed in the workpiece holder corresponding to the arranged position of the fan, so as to pump out the air in the closed space between the through-hole and the fan when the vacuum aspirator actuates, thus positioning the fan on the fixing frame due to the suction force.

Abstract: A liquid-gas circulation heat-dissipating unit includes a body having a hollow portion, a capillary structure evenly coated on an inner wall of the hollow portion and configured to soak up working fluid, and a regulating portion disposed in the body and communicating with the hollow portion. The hollow portion is filled with the working fluid of an amount more than a greatest possible amount adsorbed on the capillary structure. The regulating portion is stored with an excess of the working fluid. As a result, quantity tolerance between the working fluid of the greatest possible amount adsorbed on the capillary structure and the actually introduced working fluid increases. Accordingly, the capillary structure is adsorbed with the greatest possible amount of the working fluid and thus achieves optimal efficiency of heat dissipation.

Abstract: A heatsink device with vapor chamber is provided. The heatsink device with vapor chamber has a lid, a heat dissipation base attached to the heat generating component, and a heat conductive powder. The lid is bonded to the heat dissipation base to form an inclosed accommodation space therebetween for accommodating a heat dissipation liquid that dissipate heat according to the principle of liquid-gas phase change. A bump is disposed on the inner surface of the heat dissipation base toward the accommodation space and opposite to the heat generating component. In addition, the heat conductive powder is distributed on the above inner surface for forming capillary spaces. Meanwhile, as the conductive powder deposited on the rim of the bump is more than that on other areas, more capillary spaces are provided to conduct heat more effectively via the capillary phenomenon, thereby improving the heat dissipation effect.

Abstract: The present invention provides a vibration-proof mechanism for use with a heat-dissipating device installed in a machine unit, for absorbing vibrations caused by the operating heat-dissipating device. The vibration-proof mechanism includes a plurality of elastic components, a partitioning member connected with one side of the heat-dissipating device by the elastic components, and a fixing member connected with the partitioning member by the elastic components so as to be installed on the machine unit, thereby suspending the partitioning member midair to form a double vibration-proof structure for enhancing vibration absorption.

Abstract: A heat dissipating structure is proposed, which includes a frame, a heat dissipating element, and elastic elements. The frame encloses a central zone in which a heat generating element is disposed. The heat dissipating element has a bottom surface from which plates extend such that the heat dissipating element lies on the frame and covers the heat generating element disposed in the central zone of the frame. The elastic elements, each disposed on one of the plates, firmly secure the heat dissipating element to the frame by means of fasteners. Neither the elastic elements nor the fasteners screen the heat dissipating element and reduce the heat dissipation area thereof, thus overcoming a drawback of the conventional heat dissipating structure, that is, obstruction of the way of heat-dissipating currents.

Abstract: A heatsink-locking device that is applied to lock a heatsink to a placement surface having an exothermic component, includes a bottom base fixed on the placement surface to dispose and position the heatsink and having an open hole corresponding to the exothermic component and clamping portions at two opposing lateral sides; and a clamping tool for pressing the heatsink and being jointed to the bottom base, the clamping tool including a first board part and a second board part connected to each other with a distance between these two parts being adjustable, a third board part axially connected to the first board part to fix the adjustable distance, a pressing part fixed to the third board part to press the heatsink, and a first joint part and a second joint part disposed at one end of the first and second board parts respectively to be jointed to the clamping portion.

Abstract: A heat sink fastening structure for fixing a heat sink on a semiconductor package of a circuit board, includes a fixture having disposing space for disposing the heat sink therein; two sliding members respectively formed on the two bottom-lateral sides of the fixture; and two linkage arrangements respectively mounted on the two lateral sides of the fixture and pivotally coupled with the sliding members, so as to facilitate the movement of the linkage arrangements to drive the sliding members for fixing the heat sink thereon.

Abstract: A heat dissipating device for a heat generating component mounted on a frame-shaped carrier, includes a heat sink block, and a base having a top surface and a bottom surface. The heat sink block is mounted on the top surface of the base. A coupling board is formed on each of two opposite sides of the base at a position close to the bottom surface and lower in height than the top surface of the base. The coupling board is formed with an installing portion for being coupled to a coupling portion of the frame-shaped carrier, so as to fix the base to the frame-shaped carrier via the coupling board and allow the bottom surface of the base to cover the heat generating component on the frame-shaped carrier, to thereby make the heat sink block have a maximum heat dissipating area to dissipate heat generated by the heat generating component.