Patents by Inventor Win Jae Jessie Yuan

Win Jae Jessie Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-LEVEL MICROELECTROMECHANICAL SYSTEM STRUCTURE WITH NON-PHOTODEFINABLE ORGANIC POLYMER SPACER LAYERS
    Publication number: 20230127477
    Abstract: In an example, a method includes depositing an organic polymer layer on one or more material layers. The method also includes thermally curing the organic polymer layer. The method includes depositing a hard mask on the organic polymer layer and depositing a photoresist layer on the hard mask. The method also includes patterning the photoresist layer to expose at least a portion of the hard mask. The method includes etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer. The method also includes etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers.
    Type: Application
    Filed: April 25, 2022
    Publication date: April 27, 2023
    Inventors: Christopher Murray BEARD, Song ZHENG, John Wesley HAMLIN, III, Win-Jae Jessie YUAN, Kelly Jay TAYLOR, Jose Antonio MARTINEZ SOTO
  • MEMS via with enhanced electrical and mechanical integrity
    Patent number: 11511989
    Abstract: Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: November 29, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Earl Vedere Atnip, John Wesley Hamlin, Win Jae Jessie Yuan
  • MEMS VIA WITH ENHANCED ELECTRICAL AND MECHANICAL INTEGRITY
    Publication number: 20200207609
    Abstract: Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.
    Type: Application
    Filed: March 6, 2019
    Publication date: July 2, 2020
    Inventors: Earl Vedere Atnip, John Wesley Hamlin, Win Jae Jessie Yuan