Patents by Inventor Winata Tjandra

Winata Tjandra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP APPARATUS AND PROCESS SEQUENCE METHOD
    Publication number: 20070021038
    Abstract: A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The metrology tool is used to measure the thickness of a material layer being polished on each of successive wafers in a lot prior to the final polishing step, in order to precisely polish the layer to a desired target thickness at the final polishing step. This renders unnecessary an additional process cycle to polish the layer on each wafer to the desired target thickness. The metrology tool may be modularized as a unit with the polishing pads or belts.
    Type: Application
    Filed: September 6, 2006
    Publication date: January 25, 2007
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Shien Chen, Yai-Yei Huang, Ming-Hsiang Kao, Yih-Shung Lin, Winata Tjandra
  • CMP apparatus and process sequence method
    Publication number: 20050191942
    Abstract: A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The metrology tool is used to measure the thickness of a material layer being polished on each of successive wafers in a lot prior to the final polishing step, in order to precisely polish the layer to a desired target thickness at the final polishing step. This renders unnecessary an additional process cycle to polish the layer on each wafer to the desired target thickness. The metrology tool may be modularized as a unit with the polishing pads or belts.
    Type: Application
    Filed: February 27, 2004
    Publication date: September 1, 2005
    Inventors: Chen-Shien Chen, Yai-Yei Huang, Ming-Hsiang Kao, Yih-Shung Lin, Winata Tjandra