Abstract: A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn reduces the temperature rise of the junction temperature of the power devices inside the power module by 20% with an equivalent load current. As a consequence the weight and volume associated with the conventional cooling mechanism not employing a dual thermal interface is reduced, thus increasing the ambient operating temperature limit of a power converter in the module.

Abstract: In a MEMS device employing a beam supported by transverse arms, potential bowing of the transverse arms caused by fabrication processes, temperature or local self-heating from resistive losses is accommodated by flexible terminations of the transverse arms. Alternatively, this bowing is controlled so as to provide selective biasing to the beam or mechanical advantage in the sensing of beam motion.

Abstract: A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn reduces the temperature rise of the junction temperature of the power devices inside the power module by 20% with an equivalent load current. As a consequence the weight and volume associated with the conventional cooling mechanism not employing a dual thermal interface is reduced, thus increasing the ambient operating temperature limit of a power converter in the module.